SCHEMBL2391304

SCHEMBL2391304

NCCCCO[PH](=O)OCCCCN

nearest known ligand 0.39

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
NFKB1 P19838 2/20 0.39
CA12 O43570 2/20 0.37
CA1 P00915 2/20 0.37
CA2 P00918 2/20 0.37
CA3 P07451 2/20 0.37
CA4 P22748 2/20 0.37
CA6 P23280 2/20 0.37
CA5A P35218 2/20 0.37
CA7 P43166 2/20 0.37
CA9 Q16790 2/20 0.37
CA14 Q9ULX7 2/20 0.37
CA5B Q9Y2D0 2/20 0.37
DNM1 Q05193 1/20 0.37
LMNA P02545 1/20 0.37
TSHR P16473 1/20 0.37
BLM P54132 1/20 0.37
ODC1 P11926 1/20 0.35
CYP2D6 P10635 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28579280 0.97 DNM1 (0.42) NFKB1CA12CA1CA2CA3
SCHEMBL4408174 0.97 DNM1 (0.42) NFKB1CA12CA1CA2CA3
SCHEMBL1337335 0.92 ODC1 (0.43) NFKB1CA12CA1CA2CA3
SCHEMBL7114494 0.87 DNM1 (0.54) CA12CA1CA2CA3CA4
SCHEMBL27641478 0.80 ODC1 (0.35) TSHRODC1
SCHEMBL27489751 0.80 ODC1 (0.35) ODC1
SCHEMBL80286 0.79
SCHEMBL13048579 0.79
SCHEMBL14701727 0.79
Phosphonic Acid SCHEMBL9472597 0.77 NFKB1 (0.33) NFKB1CA12CA1CA2CA3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12251873-B2 Three-dimensional printing HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2025-03-18 US claimed
US-20250075020-A1 WATER-RETAINING MATERIAL, WATER-RETAINING PROTON EXCHANGE MEMBRANE, PREPARATION METHOD AND APPLICATION THEREOF SOUTHERN UNIVERSITY OF SCIENCE AND TECHNOLOGY (CN) 2025-03-06 US claimed
EP-3765266-B1 THREE-DIMENSIONAL PRINTING HEWLETT PACKARD DEVELOPMENT CO (US) 2024-02-21 EP claimed
CN-116272912-B Efficient and stable MOFs composite material, preparation method and carbon neutralization application 江苏交竹能源环境科技有限公司 2023-12-12 CN claimed
CN-116272912-A Efficient and stable MOFs composite material, preparation method and carbon neutralization application 江苏交竹能源环境科技有限公司 2023-06-23 CN claimed
US-20210213532-A1 THREE-DIMENSIONAL PRINTING HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2021-07-15 US claimed
EP-3765266-A1 THREE-DIMENSIONAL PRINTING Hewlett-Packard Development Company, L.P. (US) 2021-01-20 EP claimed
WO-2020072075-A1 THREE-DIMENSIONAL PRINTING HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2020-04-09 WO claimed
CN-119368142-B Zeolite molecular sieve for adsorbing and separating carbon dioxide and its preparing process 山东科技大学 2025-07-08 CN disclosed
US-12251873-B2 Three-dimensional printing HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2025-03-18 US disclosed
US-20250075020-A1 WATER-RETAINING MATERIAL, WATER-RETAINING PROTON EXCHANGE MEMBRANE, PREPARATION METHOD AND APPLICATION THEREOF SOUTHERN UNIVERSITY OF SCIENCE AND TECHNOLOGY (CN) 2025-03-06 US disclosed
CN-119368142-A Zeolite molecular sieve for adsorbing and separating carbon dioxide and its preparing process 山东科技大学 2025-01-28 CN disclosed
CN-119368142-A Zeolite molecular sieve for adsorbing and separating carbon dioxide and its preparing process 山东科技大学 2025-01-28 CN disclosed
CN-119265956-A Flame-retardant sun-shading foaming coating fabric and preparation method thereof 浙江德易遮阳科技股份有限公司 2025-01-07 CN disclosed
US-20080139778-A1 Resin and article molded therefrom TAKANISHI KEIJIRO 2008-06-12 US disclosed
US-20060287464-A1 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2006-12-21 US disclosed
EP-1640405-A1 RESIN AND ARTICLE MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2006-03-29 EP disclosed
US-6750313-B2 HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP TORAY INDUSTRIES, INC. (JP) 2004-06-15 US disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 EP disclosed