Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 2/20 | 0.33 |
| ▸ | CYP2A6 | P11509 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 3/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.31 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
| ▸ | PKM | P14618 | 1/20 | 0.31 |
| ▸ | RAB9A | P51151 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1042696 | 0.83 | ALDH1A1 (0.32) | KMT2AMEN1ALDH1A1SMN1; SMN2 | |
| SCHEMBL1037618 | 0.80 | ALDH1A1 (0.34) | CYP2A6MAPTKMT2AKDM4EMEN1 | |
| SCHEMBL13932526 | 0.75 | METAP1 (0.36) | MAPTKMT2AKDM4EMEN1ALDH1A1 | |
| SCHEMBL37311 | 0.73 | MEN1 (0.33) | CYP1A2CYP2A6MAPTKMT2AMEN1 | |
| SCHEMBL15411118 | 0.70 | ALDH1A1 (0.34) | CYP2A6MAPTKMT2AKDM4EMEN1 | |
| SCHEMBL82772 | 0.70 | ALDH1A1 (0.34) | CYP2A6MAPTKMT2AKDM4EMEN1 | |
| SCHEMBL11661088 | 0.69 | PGR (0.33) | — | |
| SCHEMBL4027300 | 0.68 | NPC1 (0.30) | CYP1A2CYP2A6MAPTLMNAALDH1A1 | |
| SCHEMBL2397416 | 0.68 | — | — | |
| SCHEMBL1041155 | 0.68 | DRD1 (0.35) | KMT2AMEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107561858-B | Polyimide dry film and use thereof | 长兴材料工业股份有限公司 | 2021-01-08 | — | — | CN | disclosed |
| US-10639876-B2 | Solvent-containing dry film and method for applying the same on a substrate | ETERNAL MATERIALS CO., LTD. (TW) | 2020-05-05 | — | — | US | disclosed |
| US-10590305-B2 | Polyimide dry film and application thereof | ETERNAL MATERIALS CO., LTD. (TW) | 2020-03-17 | — | — | US | disclosed |
| CN-105068376-B | Solvent-containing dry film and method for applying dry film on substrate | 长兴材料工业股份有限公司 | 2020-01-07 | — | — | CN | disclosed |
| CN-107561858-A | polyimide dry film and use thereof | 长兴材料工业股份有限公司 | 2018-01-09 | — | — | CN | disclosed |
| US-20180002567-A1 | POLYIMIDE DRY FILM AND APPLICATION THEREOF | ETERNAL MATERIALS CO., LTD. (TW) | 2018-01-04 | — | — | US | disclosed |
| US-20160017105-A1 | SOLVENT-CONTAINING DRY FILM AND METHOD FOR APPLYING THE SAME ON A SUBSTRATE | ETERNAL MATERIALS CO., LTD. (TW) | 2016-01-21 | — | — | US | disclosed |
| CN-103788879-B | Acrylic adhesive composition and application thereof | ETERNAL MATERIALS CO.,LTD. (CN) | 2016-01-20 | — | — | CN | disclosed |
| CN-105068376-A | Solvent-containing dry film and method for applying dry film on substrate | ETERNAL MATERIALS CO LTD | 2015-11-18 | — | — | CN | disclosed |
| CN-102417795-B | Acrylic adhesive composition and application thereof | ETERNAL CHEMICAL CO LTD | 2015-05-20 | — | — | CN | disclosed |
| US-20020048726-A1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-04-25 | — | — | US | disclosed |
| US-20020027268-A1 | Resin-encapsulated semiconductor apparatus and process for its fabrication | HITACHI, LTD. | 2002-03-07 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |
| US-6319656-B1 | FORMING FILM OF A NEGATIVE-WORKING PHOTO-SENSITIVE POLYIMIDE PRECURSOR ON A SUBSTRATE; EXPOSING FILM TO LIGHT THROUGH A MASK HAVING A PREDETERMINED PATTERN; DEVELOPING THE EXPOSED FILM USING AN ALKALINE AQUEOUS SOLUTION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-11-20 | — | — | US | disclosed |
| US-6200831-B1 | HEAT-CURING A COATING OF A POLYAMIC ACID BASED ON A TETRACARBOXYLIC ACID AND A DIAMINE CONTAINNG AN ACTIVE OXYGEN OR NITROGEN FUNCTIONAL GROUP; SEALING THE EXTERNAL TERMINALS WITH A RESIN, E.G. AN EPOXIDE | HITACHI, LTD. (JP) | 2001-03-13 | — | — | US | disclosed |
| US-6147374-A | Resin-encapsulated semiconductor apparatus | HITACHI, LTD. (JP) | 2000-11-14 | — | — | US | disclosed |
| US-6087006-A | SEMICONDUCTOR DEVICE HAVING SURFACE-PROTECTING FILM COMPRISING POLYIMIDE OBTAINED BY HEAT-CURING PRECURSOR HAVING POLAR SUBSTITUENTS AS THE SIDE CHAINS | HITACHI, LTD. (JP) | 2000-07-11 | — | — | US | disclosed |
| US-6025113-A | FOR PREPARING HIGHLY SENSITIVE NEGATIVE-WORKING PHOTOSENSITIVE MATERIAL DEVELOPABLE WITH ALKALINE AQUEOUS SOLUTION IN SHORT TIME WITH HIGH RESOLUTION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-15 | — | — | US | disclosed |
| EP-0814109-A1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1997-12-29 | — | — | EP | disclosed |
| EP-0475086-A1 | Photo-sensitive polymer composition | HITACHI, LTD. (JP) | 1992-03-18 | — | — | EP | disclosed |