SCHEMBL23918813

SCHEMBL23918813

CCC(=O)CCc1ccc(C(F)(F)F)cc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IAPP P10997 1/20 0.53
FFAR1 O14842 1/20 0.51
HRH3 Q9Y5N1 2/20 0.51
PDPK1 O15530 1/20 0.50
PLAAT3 P53816 1/20 0.49
PLAAT5 Q96KN8 1/20 0.49
PLAAT2 Q9NWW9 1/20 0.49
PLAAT4 Q9UL19 1/20 0.49
TAAR1 Q96RJ0 1/20 0.48
HDAC1 Q13547 1/20 0.47
HDAC8 Q9BY41 1/20 0.47
PPARG P37231 1/20 0.43
PPARA Q07869 1/20 0.43
MAOB P27338 1/20 0.43
DAO P14920 1/20 0.43
SRD5A2 P31213 1/20 0.42
CES2 O00748 1/20 0.42
CES1 P23141 1/20 0.42
UTS2R Q9UKP6 1/20 0.42
MCHR1 Q99705 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7332151 0.89 FFAR1 (0.57) FFAR1HRH3PDPK1PLAAT3PLAAT5
SCHEMBL2940991 0.84 IAPP (0.54) IAPP
SCHEMBL28168509 0.82 IAPP (0.49) IAPPDAOCES2
SCHEMBL1294972 0.82 TAAR1 (0.58) FFAR1HRH3PDPK1PLAAT3PLAAT5
SCHEMBL408215 0.82 PTPN1 (0.53) FFAR1HRH3PDPK1PLAAT3PLAAT5
SCHEMBL4657783 0.81 PIK3CA (0.50) HRH3HDAC1HDAC8MAOBSRD5A2
SCHEMBL266389 0.81 ALDH1A1 (0.57) FFAR1HRH3PDPK1PLAAT3PLAAT5
SCHEMBL24241957 0.81 FFAR1 (0.51) FFAR1HRH3PDPK1PLAAT3PLAAT5
SCHEMBL7090409 0.81 FFAR1 (0.61) FFAR1PDPK1PLAAT3PLAAT5PLAAT2
SCHEMBL24242141 0.80 FFAR1 (0.47) FFAR1HRH3PDPK1PLAAT3PLAAT5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed