SCHEMBL23918992

SCHEMBL23918992

Nc1ccc(C(=O)NS(=O)(=O)c2ccccc2N)cc1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.62
MEN1 O00255 3/20 0.62
KMT2A Q03164 3/20 0.62
PTGES O14684 1/20 0.52
CA9 Q16790 4/20 0.45
GAA P10253 1/20 0.44
PRMT1 Q99873 2/20 0.43
TDP1 Q9NUW8 2/20 0.43
POLB P06746 1/20 0.43
PKM P14618 1/20 0.43
APEX1 P27695 1/20 0.43
CA1 P00915 4/20 0.43
CA2 P00918 4/20 0.43
FLT1 P17948 2/20 0.43
FLT4 P35916 2/20 0.43
KDR P35968 2/20 0.43
CA12 O43570 2/20 0.43
CYP2C9 P11712 2/20 0.43
L3MBTL1 Q9Y468 1/20 0.43
CA4 P22748 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23918989 0.80 CA9 (0.47) CA9GAACA1CA2FLT1
SCHEMBL8660071 0.80 MEN1 (0.87) LMNAMEN1KMT2ACA9PRMT1
SCHEMBL4818961 0.78 MEN1 (0.83) LMNAMEN1KMT2ACA9TDP1
SCHEMBL3069664 0.78 GAA (0.52) LMNAMEN1KMT2ACA9GAA
Sulfabenzamide SCHEMBL93841 0.77 KMT2A (1.00) LMNAMEN1KMT2ACA9PRMT1
SCHEMBL30307520 0.76 DHFR (0.53) LMNAMEN1KMT2ACA9GAA
SCHEMBL23887319 0.76 DHFR (0.53) LMNAMEN1KMT2ACA9GAA
Sulfabenzamide SCHEMBL16415986 0.75 KMT2A (0.97) LMNAMEN1KMT2ACA9PRMT1
SCHEMBL14900178 0.75 GAA (0.58) LMNAMEN1KMT2ACA9GAA
SCHEMBL19332271 0.73 CA9 (0.47) LMNAKMT2ACA9GAACA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed