SCHEMBL23918989

SCHEMBL23918989

Nc1ccccc1C(=O)NS(=O)(=O)c1ccccc1N

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA9 Q16790 5/20 0.47
GAA P10253 2/20 0.47
FLT1 P17948 3/20 0.47
FLT4 P35916 3/20 0.47
KDR P35968 3/20 0.47
KDM4E B2RXH2 3/20 0.46
CA1 P00915 5/20 0.46
CA2 P00918 5/20 0.46
CA12 O43570 1/20 0.46
CYP2C9 P11712 1/20 0.46
CA4 P22748 1/20 0.46
CA6 P23280 1/20 0.46
CA5A P35218 1/20 0.46
CA7 P43166 1/20 0.46
CA14 Q9ULX7 1/20 0.46
CA5B Q9Y2D0 1/20 0.46
HPGD P15428 2/20 0.45
ALDH1A1 P00352 4/20 0.44
CFTR P13569 1/20 0.44
HSD17B10 Q99714 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4196246 0.87 CA1 (0.61) CA9FLT1FLT4KDRKDM4E
SCHEMBL4196234 0.83 KDM4E (0.68) CA9FLT1FLT4KDRKDM4E
SCHEMBL2294952 0.80 ALDH1A1 (0.48) GAAKDM4EHPGDALDH1A1CFTR
SCHEMBL3069664 0.80 GAA (0.52) CA9GAACA1CA2CA12
SCHEMBL10636104 0.80 ALDH1A1 (0.49) CA9GAAKDM4ECA1CA2
SCHEMBL23918992 0.80 LMNA (0.62) CA9GAAFLT1FLT4KDR
SCHEMBL4472196 0.79 HPGD (0.47) CA9GAAFLT1FLT4KDR
SCHEMBL30307520 0.79 DHFR (0.53) CA9GAAKDM4ECA1CA2
SCHEMBL23887319 0.79 DHFR (0.53) CA9GAAKDM4ECA1CA2
SCHEMBL4202292 0.79 MYC (0.55) GAAKDM4EHPGDALDH1A1CFTR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed