SCHEMBL23918994

SCHEMBL23918994

Nc1ccc(C(=O)NS(=O)(=O)c2cccc(N)c2)cc1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.65
MEN1 O00255 1/20 0.65
KMT2A Q03164 1/20 0.65
F2 P00734 3/20 0.51
PRSS1 P07477 3/20 0.51
PRSS2 P07478 3/20 0.51
PRSS3 P35030 3/20 0.51
TSHR P16473 2/20 0.50
TDP1 Q9NUW8 2/20 0.50
ALDH1A1 P00352 1/20 0.50
HSD17B10 Q99714 1/20 0.50
POLB P06746 1/20 0.50
KAT6A Q92794 1/20 0.49
CA2 P00918 2/20 0.49
FLT1 P17948 2/20 0.49
FLT4 P35916 2/20 0.49
KDR P35968 2/20 0.49
CYP19A1 P11511 1/20 0.48
PTGS1 P23219 1/20 0.48
PTGS2 P35354 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6158564 0.91 MEN1 (0.69) LMNAMEN1KMT2AF2PRSS1
SCHEMBL5742177 0.90 FLT1 (0.65) LMNAMEN1KMT2AFLT1FLT4
SCHEMBL8660071 0.85 MEN1 (0.87) LMNAMEN1KMT2ATSHRTDP1
SCHEMBL5744434 0.84 PKM (0.54) LMNAMEN1KMT2AF2PRSS1
SCHEMBL4818961 0.83 MEN1 (0.83) LMNAMEN1KMT2ATSHRTDP1
SCHEMBL6159257 0.81 MEN1 (0.69) LMNAMEN1KMT2AKAT6AFLT1
SCHEMBL5050574 0.80 F2 (0.61) LMNAKMT2AF2PRSS1PRSS2
Hydrochloric Acid SCHEMBL8303230 0.80 MEN1 (0.68) LMNAMEN1KMT2AKAT6AFLT1
Sulfabenzamide SCHEMBL93841 0.79 KMT2A (1.00) LMNAMEN1KMT2ATSHRTDP1
SCHEMBL6297904 0.79 TSHR (0.64) LMNAF2PRSS1PRSS2PRSS3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed