SCHEMBL23940781

SCHEMBL23940781

O=c1n(CCC2CO2)c(=O)n(CC2CO2)c(=O)n1CC1CO1

nearest known ligand 0.75

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.75
HBB P68871 1/20 0.75
SMN1; SMN2 Q16637 1/20 0.75
DHFR P00374 1/20 0.41
MAPT P10636 1/20 0.33
ALDH1A1 P00352 2/20 0.30
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8579242 0.91 TP53 (0.58) TP53HBBSMN1; SMN2DHFRALDH1A1
SCHEMBL10963410 0.89 TP53 (0.86) TP53HBBSMN1; SMN2DHFRMAPT
SCHEMBL19407057 0.89 TP53 (0.59) TP53HBBSMN1; SMN2DHFRMAPT
Teroxirone SCHEMBL2097151 0.87 TP53 (1.00) TP53HBBSMN1; SMN2DHFRMAPT
Teroxirone SCHEMBL2097375 0.87 TP53 (1.00) TP53HBBSMN1; SMN2DHFRMAPT
Teroxirone SCHEMBL4470513 0.87 TP53 (1.00) TP53HBBSMN1; SMN2DHFRMAPT
Teroxirone SCHEMBL4932 0.87 TP53 (1.00) TP53HBBSMN1; SMN2DHFRMAPT
Teroxirone SCHEMBL4452999 0.87 TP53 (1.00) TP53HBBSMN1; SMN2DHFRMAPT
Teroxirone SCHEMBL4461477 0.87 TP53 (1.00) TP53HBBSMN1; SMN2DHFRMAPT
Teroxirone SCHEMBL4472568 0.87 TP53 (1.00) TP53HBBSMN1; SMN2DHFRMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4012499-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2022-06-15 EP disclosed
EP-3974904-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2022-03-30 EP disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed