SCHEMBL23966382

SCHEMBL23966382

Cc1ccc(Oc2ccc(NC(=O)OC(C)(C)C)cc2)cc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 3/20 0.53
SMN1; SMN2 Q16637 3/20 0.53
NPC1 O15118 4/20 0.51
RAB9A P51151 4/20 0.51
CRHBP P24387 1/20 0.51
CRHR2 Q13324 1/20 0.51
PNLIP P16233 1/20 0.51
ALDH1A1 P00352 2/20 0.50
HTT P42858 2/20 0.50
LMNA P02545 1/20 0.50
GAA P10253 1/20 0.50
ALOX15 P16050 1/20 0.50
TSHR P16473 1/20 0.50
MAPK1 P28482 1/20 0.50
L3MBTL1 Q9Y468 1/20 0.50
MAPK14 Q16539 1/20 0.50
CYP17A1 P05093 2/20 0.48
LTA4H P09960 1/20 0.47
MMP13 P45452 1/20 0.46
CA12 O43570 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29131710 0.93 HPGD (0.59) HPGDSMN1; SMN2NPC1RAB9ACRHBP
SCHEMBL178373 0.92 CYP17A1 (0.54) SMN1; SMN2NPC1RAB9AALDH1A1CYP17A1
SCHEMBL20865538 0.89 CYP17A1 (0.59) HPGDSMN1; SMN2NPC1RAB9ACRHBP
SCHEMBL29131712 0.87 HPGD (0.71) HPGDSMN1; SMN2NPC1RAB9ACRHBP
SCHEMBL20469627 0.86 MEN1 (0.53) HPGDSMN1; SMN2NPC1RAB9ACRHBP
SCHEMBL20865537 0.86 HPGD (0.51) HPGDSMN1; SMN2NPC1RAB9ACRHBP
SCHEMBL31483499 0.86 ALDH1A1 (0.52) HPGDSMN1; SMN2NPC1RAB9ACRHBP
SCHEMBL12330773 0.86 CDK8 (0.51) HPGDSMN1; SMN2NPC1RAB9ACRHBP
SCHEMBL19853243 0.84 MTNR1B (0.58) HPGDSMN1; SMN2NPC1RAB9ACRHBP
SCHEMBL23637726 0.84 CYP17A1 (0.63) HPGDSMN1; SMN2NPC1RAB9ACRHBP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230221639-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-07-13 US disclosed
US-20230221639-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-07-13 US disclosed
US-11640112-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-05-02 US disclosed
US-11640112-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-05-02 US disclosed
US-20220011669-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2022-01-13 US disclosed
US-11163234-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-11-02 US disclosed