SCHEMBL2399243

SCHEMBL2399243

CCC(C)CN(CC(C)CC)CC(C)CC

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5948737 0.87 PLA2G1B (0.30) TSHR
SCHEMBL5948506 0.87 PLA2G1B (0.34) TSHR
SCHEMBL18371735 0.86 TSHR (0.45) TSHR
SCHEMBL11501747 0.82
SCHEMBL14770044 0.82 HRH3 (0.30)
SCHEMBL24379286 0.82 HRH3 (0.30)
SCHEMBL12569429 0.82
SCHEMBL18371736 0.80 LMNA (0.35) TSHR
SCHEMBL24928933 0.80 CYP1A2 (0.37)
SCHEMBL24522571 0.78 KDM4E (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0283375-B1 PROCESS FOR THE PREPARATION OF POLYCHLOROPHOSPHAZENE ELF ATOCHEM S.A. (FR) 1991-10-30 EP claimed
US-4810480-A Preparation of polychlorophosphazene ATOCHEM (FR) 1989-03-07 US claimed
US-9435032-B2 Method for forming patterned conductive film JAPAN SCIENCE AND TECHNOLOGY AGENCY (JP) 2016-09-06 US disclosed
US-8828555-B2 Method for forming patterned conductive film JAPAN SCIENCE AND TECHNOLOGY AGENCY (JP) 2014-09-09 US disclosed
US-20140227436-A1 METHOD FOR FORMING PATTERNED CONDUCTIVE FILM JAPAN SCIENCE AND TECHNOLOGY AGENCY (JP) 2014-08-14 US disclosed
US-8597424-B2 Composition and method for forming an aluminum film JSR CORPORATION (JP) 2013-12-03 US disclosed
US-20120298402-A1 METHOD FOR FORMING PATTERNED CONDUCTIVE FILM JSR CORPORATION (JP) 2012-11-29 US disclosed
US-20110229654-A1 COMPOSITION AND METHOD FOR FORMING AN ALUMINUM FILM JSR CORPORATION (JP) 2011-09-22 US disclosed
EP-2226368-A1 COMPOSITION FOR FORMING ALUMINUM FILM AND METHOD FOR FORMING ALUMINUM FILM JSR Corporation (JP) 2010-09-08 EP disclosed
US-7776766-B2 Trench filling method JSR CORPORATION (JP) 2010-08-17 US disclosed
EP-2204472-A2 Methods for forming wiring and electrode JSR Corporation (JP) 2010-07-07 EP disclosed
US-20060257667-A1 Composition for forming silicon-aluminum film, silicon-aluminum film and method for forming the same JSR CORPORATION (JP) 2006-11-16 US disclosed
US-7071084-B2 Methods for forming wiring and electrode JSR CORPORATION (JP) 2006-07-04 US disclosed
US-20060024937-A1 Methods for forming wiring and electrode JSR CORPORATION (JP) 2006-02-02 US disclosed
US-20050227155-A1 Electrophoretic particles, electrophoretic dispersion liquid, and electrophoretic display device CANON KABUSHIKI KAISHA (JP) 2005-10-13 US disclosed
US-6953600-B2 Complex of an amine compound and aluminum hydride and an organic solvent used to form wiring or an electrode which can be suitably used in a variety of electronic devices JSR CORPORATION (JP) 2005-10-11 US disclosed
US-20040192038-A1 Methods for forming wiring and electrode JSR CORPORATION (JP) 2004-09-30 US disclosed
EP-1462544-A2 Methods for forming wiring and electrode JSR Corporation (JP) 2004-09-29 EP disclosed
US-20030224152-A1 Complex of an amine compound and aluminum hydride and an organic solvent used to form wiring or an electrode which can be suitably used in a variety of electronic devices JSR CORPORATION (JP) 2003-12-04 US disclosed
US-4810480-A Preparation of polychlorophosphazene ATOCHEM (FR) 1989-03-07 US disclosed