SCHEMBL2399737

SCHEMBL2399737

O=P(O)(O)OCC(Cl)C(Cl)(CC(Br)CBr)CC(Br)CBr

nearest known ligand 0.35

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
PGK1 P00558 1/20 0.33
PGK2 P07205 1/20 0.33
PGD P52209 2/20 0.32
MPI P34949 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11599509 0.75
SCHEMBL4625392 0.75 PGK1 (0.36) PGK1PGK2PGDMPI
SCHEMBL2239094 0.74 PGK1 (0.45) PGK1PGK2PGDMPI
SCHEMBL11599121 0.73 PGK1 (0.35) PGK1PGK2PGDMPI
SCHEMBL7703757 0.73 PGK1 (0.35) PGK1PGK2PGDMPI
Ammonia Solution, Strong SCHEMBL11700135 0.73 PGK1 (0.43) PGK1PGK2PGDMPI
SCHEMBL11601014 0.73 PGK1 (0.43) PGK1PGK2PGDMPI
Ammonia Solution, Strong SCHEMBL11596350 0.73 PGK1 (0.43) PGK1PGK2PGDMPI
SCHEMBL11600625 0.72 LPAR3 (0.31)
SCHEMBL11600396 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 130 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7468408-B2 Flame-retardant styrene resin composition DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2008-12-23 US claimed
EP-1141114-B1 POLYCARBONATE RESIN COMPOSITION GEN ELECTRIC (US) 2004-10-06 EP claimed
US-4729854-A HALOGEN COMPOUND, MOLDING MATERIALS, CORROSION RESISTANCE KYOWA CHEMICAL INDUSTRY CO., LTD. (JP) 1988-03-08 US claimed
US-12583951-B2 Monomer mixture, resin composition, resin molded article, panel for aquariums, illuminated sign, building component, method for producing resin composition, and method for manufacturing resin cast board MITSUBISHI CHEMICAL CORPORATION (JP) 2026-03-24 US disclosed
EP-4692263-A1 THERMALLY EXPANDABLE REFRACTORY MATERIAL COMPOSITION, THERMALLY EXPANDABLE REFRACTORY MATERIAL, AND METHOD FOR PRODUCING THERMALLY EXPANDABLE REFRACTORY MATERIAL Sekisui Chemical Co., Ltd. (JP) 2026-02-11 EP disclosed
US-20250368822-A1 RESIN COMPOSITION AND MOLDED ARTICLE ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-12-04 US disclosed
EP-3179484-B1 INSULATION FILM AND FLEXIBLE FLAT CABLE DOOSAN CORP (KR) 2025-03-19 EP disclosed
CN-114716805-B Resin composition, connection structure for solar power generation module, and junction box for solar power generation module 旭化成株式会社 2024-11-26 CN disclosed
WO-2024204161-A1 THERMALLY EXPANDABLE REFRACTORY MATERIAL COMPOSITION, THERMALLY EXPANDABLE REFRACTORY MATERIAL, AND METHOD FOR PRODUCING THERMALLY EXPANDABLE REFRACTORY MATERIAL 積水化学工業株式会社 2024-10-03 WO disclosed
EP-2554599-B2 POLYCARBONATE RESIN COMPOSITION, METHOD FOR PRODUCING SAME AND MOLDED ARTICLE OF THIS RESIN COMPOSITION MITSUBISHI CHEM CORP (JP) 2024-08-28 EP disclosed
CN-114929789-B CFRP structure, method for producing CFRP structure, carbon fiber prepreg, and method for producing carbon fiber prepreg 三菱化学株式会社 2024-08-23 CN disclosed
EP-0631339-A2 Secondary battery CANON KABUSHIKI KAISHA (JP) 1994-12-28 EP disclosed
EP-0352875-B1 A polystyrene resin composition having improved stiffness ASAHI CHEMICAL IND (JP) 1994-11-30 EP disclosed
US-5229446-A Rubber-reinforced polystyrene, potassium titanate, higher fatty acid and, or its metal salt ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1993-07-20 US disclosed
US-5136683-A Plastic optical fiber, covering of chlorinated polyethylene of specific oxygen index MITSUBISHI RAYON COMPANY, LTD. (JP) 1992-08-04 US disclosed
EP-0418094-A2 Flame-retardant cable MITSUBISHI RAYON CO., LTD (JP) 1991-03-20 EP disclosed
US-4833181-A METALLIC SOAP, AMINE ANTIOXIDANT TONEN SEKIYUKAGAKU KABUSHIKI KAISHA (JP) 1989-05-23 US disclosed
US-4729854-A HALOGEN COMPOUND, MOLDING MATERIALS, CORROSION RESISTANCE KYOWA CHEMICAL INDUSTRY CO., LTD. (JP) 1988-03-08 US disclosed
EP-0129805-B1 FIRE-RETARDANT RESIN COMPOSITION KYOWA CHEMICAL INDUSTRY CO., LTD. (JP) 1988-01-20 EP disclosed
US-4267220-A COMPRISING FIBERS OF A GRAFT POLYMER OR BLEND OF POLYVINYL ALCOHOL AND POLYVINYL CHLORIDE AND A LUBRICANT-OIL DUST ADSORBER DUSKIN FRANCHISE CO., LTD. (JP) 1981-05-12 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12583951-B2 Monomer mixture, resin composition, resin molded article, panel for aquariums, illuminated sign, building component, method for producing resin composition, and method for manufacturing resin cast board MAT1A, ASH2L, PHOSPHO1 PGK1 1549/4885PGK2 2512/4885PGD 1342/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.