SCHEMBL24176806

SCHEMBL24176806

COC(=O)c1cc2ccc(N(C)C)cc2oc1=O

nearest known ligand 0.72

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC16A3 O15427 3/20 0.72
ALDH1A1 P00352 5/20 0.63
HPGD P15428 5/20 0.63
KDM4E B2RXH2 4/20 0.63
MAOB P27338 11/20 0.58
MAOA P21397 8/20 0.56
ATM Q13315 3/20 0.53
MEN1 O00255 2/20 0.53
MAPT P10636 2/20 0.53
KMT2A Q03164 2/20 0.53
SMN1; SMN2 Q16637 2/20 0.53
CA12 O43570 2/20 0.53
CA2 P00918 2/20 0.53
CA3 P07451 2/20 0.53
CA6 P23280 2/20 0.53
CA7 P43166 2/20 0.53
CA9 Q16790 2/20 0.53
CA14 Q9ULX7 2/20 0.53
SLC16A1 P53985 2/20 0.53
HSD17B10 Q99714 2/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2030497 0.85 SLC16A3 (0.81) SLC16A3ALDH1A1HPGDKDM4EMAOB
SCHEMBL2911015 0.85 MAOB (0.80) SLC16A3ALDH1A1HPGDKDM4EMAOB
SCHEMBL2911594 0.85 MAOB (0.80) SLC16A3ALDH1A1HPGDKDM4EMAOB
SCHEMBL24803038 0.85 SLC16A3 (0.67) SLC16A3ALDH1A1HPGDKDM4EMAOB
SCHEMBL5146396 0.84 SLC16A3 (0.66) SLC16A3ALDH1A1HPGDKDM4EMAOB
SCHEMBL2031972 0.84 SLC16A3 (0.78) SLC16A3ALDH1A1HPGDKDM4EMAOB
SCHEMBL839032 0.84 SLC16A3 (1.00) SLC16A3ALDH1A1HPGDKDM4EMAOB
SCHEMBL28351884 0.83 KDM4E (0.68) SLC16A3ALDH1A1HPGDKDM4EMAOB
SCHEMBL28456792 0.83 SLC16A3 (0.76) SLC16A3ALDH1A1HPGDKDM4EMAOB
SCHEMBL14111521 0.83 SLC16A3 (0.76) SLC16A3ALDH1A1HPGDKDM4EMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230229084-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-20 US disclosed
US-20230229084-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-20 US disclosed
CN-115989457-A Method for producing cured product, method for producing laminate, and method for producing semiconductor device 富士胶片株式会社 2023-04-18 CN disclosed
CN-115768832-A Resin composition, method for producing same, and method for producing composition for pattern formation 富士胶片株式会社 2023-03-07 CN disclosed
WO-2022004290-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD FOR MANUFACTURING PLATING MOLD-ATTACHED SUBSTRATE, AND METHOD FOR MANUFACTURING PLATED OBJECT 東京応化工業株式会社 2022-01-06 WO disclosed