SCHEMBL2031972

SCHEMBL2031972

CC(=O)c1cc2ccc(N(C)C)cc2oc1=O

nearest known ligand 0.78

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC16A3 O15427 3/20 0.78
MAOB P27338 6/20 0.72
MEN1 O00255 3/20 0.72
MAPT P10636 3/20 0.72
KMT2A Q03164 3/20 0.72
CYP1A2 P05177 2/20 0.72
ATM Q13315 2/20 0.72
USP2 O75604 1/20 0.72
CYP2C19 P33261 1/20 0.72
KDM4E B2RXH2 3/20 0.66
GAA P10253 2/20 0.66
S1PR4 O95977 1/20 0.66
GLA P06280 1/20 0.66
MIF P14174 1/20 0.66
S1PR1 P21453 1/20 0.66
CA12 O43570 2/20 0.64
CA9 Q16790 2/20 0.64
ALDH1A1 P00352 3/20 0.61
HPGD P15428 3/20 0.61
NT5E P21589 1/20 0.60

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2030497 0.89 SLC16A3 (0.81) SLC16A3MAOBMEN1MAPTKMT2A
SCHEMBL839032 0.88 SLC16A3 (1.00) SLC16A3MAOBMEN1MAPTKMT2A
SCHEMBL28943174 0.88 MAOB (0.73) SLC16A3MAOBMEN1MAPTKMT2A
SCHEMBL14111521 0.87 SLC16A3 (0.76) SLC16A3MAOBMEN1MAPTKMT2A
SCHEMBL28456792 0.87 SLC16A3 (0.76) SLC16A3MAOBMEN1MAPTKMT2A
SCHEMBL5466592 0.85 MAOB (0.64) SLC16A3MAOBMEN1MAPTKMT2A
SCHEMBL24176806 0.84 SLC16A3 (0.72) SLC16A3MAOBMEN1MAPTKMT2A
SCHEMBL51307 0.84 SLC16A3 (0.72) SLC16A3MAOBMEN1MAPTKMT2A
SCHEMBL5144937 0.84 SLC16A3 (0.72) SLC16A3MAOBMEN1MAPTKMT2A
SCHEMBL11225033 0.84 SLC16A3 (0.72) SLC16A3MAOBMEN1MAPTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 556 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111522200-B Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2021-07-27 CN claimed
CN-111522200-A Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2020-08-11 CN claimed
WO-2026100508-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2026-05-15 WO disclosed
US-12622847-B2 Organosilicon compound and dental composition containing same KURARAY NORITAKE DENTAL INC. (JP) 2026-05-12 US disclosed
EP-4736835-A1 DENTAL POLYMERIZABLE COMPOSITION Kuraray Noritake Dental Inc. (JP) 2026-05-06 EP disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-03-05 US disclosed
US-12564543-B2 Dental composition KURARAY NORITAKE DENTAL INC. (JP) 2026-03-03 US disclosed
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-02-05 US disclosed
EP-0559900-B1 METHOD OF SURFACE TREATING ROLLING ROLL NIPPON STEEL CORP (JP) 1997-12-29 EP disclosed
EP-0580108-B1 A photosensitive polyimide composition ASAHI CHEMICAL IND (JP) 1997-03-12 EP disclosed
EP-0738928-A2 Visible-ray polymerization initiator and visible-ray polymerizable composition TOKUYAMA CORPORATION (JP) 1996-10-23 EP disclosed
EP-0718696-A2 A photosensitive polyimide composition ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1996-06-26 EP disclosed
US-5397682-A Polyimide precursor and photosensitive composition containing the same ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1995-03-14 US disclosed
WO-1994006057-A1 POLYIMIDE PRECURSOR AND PHOTOSENSITIVE COMPOSITION CONTAINING THE SAME ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1994-03-17 WO disclosed
US-5294297-A Photocuring NIPPON STEEL CORPORATION (JP) 1994-03-15 US disclosed
EP-0580108-A2 A photosensitive polyimide composition ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1994-01-26 EP disclosed
EP-0559900-A1 METHOD OF SURFACE TREATING ROLLING ROLL NIPPON STEEL CORPORATION (JP) 1993-09-15 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (7 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 SLC16A3 1421/4885MAOB 4827/4885MEN1 3372/4885
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR SLC16A3 3827/4885MAOB 3277/4885MEN1 4037/4885
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 SLC16A3 3127/4885MAOB 2517/4885MEN1 2775/4885
US-12564543-B2 Dental composition CAD, ARCN1, MAT1A SLC16A3 3354/4885MAOB 4479/4885MEN1 2119/4885
US-12622847-B2 Organosilicon compound and dental composition containing same MSL1, ITGA1, ITGAL SLC16A3 4091/4885MAOB 3945/4885MEN1 1873/4885
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE RER1, ASIC1, FRG1 SLC16A3 3039/4885MAOB 3218/4885MEN1 2602/4885
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ARCN1, PBRM1, LCP1 SLC16A3 2173/4885MAOB 3403/4885MEN1 958/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.