SCHEMBL24282247

SCHEMBL24282247

CCc1cc(C(c2ccc(-c3ccc(C(c4ccc(O)c(C)c4)c4ccc(O)c(C)c4)cc3)cc2)c2ccc(O)c(C)c2)ccc1O

nearest known ligand 0.46

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
HSD17B1 P14061 4/20 0.46
CYP17A1 P05093 1/20 0.41
ESR1 P03372 9/20 0.40
ESR2 Q92731 8/20 0.40
AR P10275 4/20 0.40
HSD17B2 P37059 2/20 0.39
BACE1 P56817 1/20 0.38
HSP90AA1 P07900 1/20 0.36
HSP90AB1 P08238 1/20 0.36
TP53 P04637 1/20 0.36
TDP1 Q9NUW8 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22839368 0.91 HSD17B1 (0.40) HSD17B1CYP17A1ESR1ESR2AR
SCHEMBL25998371 0.87 ALDH1A1 (0.49) HSD17B1ESR1ESR2ARBACE1
SCHEMBL10445995 0.87 HSD17B1 (0.48) HSD17B1CYP17A1ESR1ESR2AR
SCHEMBL1758246 0.87 ESR1 (0.50) HSD17B1ESR1ESR2BACE1HSP90AA1
SCHEMBL16790388 0.82 ESR1 (0.43) HSD17B1ESR1ESR2ARBACE1
SCHEMBL1596751 0.81 TP53 (0.52) HSD17B1ESR1ESR2ARHSD17B2
SCHEMBL12922915 0.80 HSD17B1 (0.51) HSD17B1CYP17A1ESR1ESR2HSD17B2
SCHEMBL9608273 0.80 ESR1 (0.50) ESR1ESR2ARTP53TDP1
SCHEMBL3325227 0.80 ESR1 (0.44) HSD17B1ESR1ESR2BACE1HSP90AA1
SCHEMBL29465801 0.79 TP53 (0.54) HSD17B1ESR1ESR2ARHSD17B2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3974904-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2022-03-30 EP disclosed