Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 4/20 | 0.59 |
| ▸ | BLM | P54132 | 3/20 | 0.59 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.59 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.59 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.59 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.57 |
| ▸ | ANPEP | P15144 | 1/20 | 0.56 |
| ▸ | CA12 | O43570 | 3/20 | 0.53 |
| ▸ | CA6 | P23280 | 3/20 | 0.53 |
| ▸ | CA7 | P43166 | 3/20 | 0.53 |
| ▸ | CA9 | Q16790 | 3/20 | 0.53 |
| ▸ | CA14 | Q9ULX7 | 3/20 | 0.53 |
| ▸ | CA5B | Q9Y2D0 | 3/20 | 0.53 |
| ▸ | MEN1 | O00255 | 1/20 | 0.53 |
| ▸ | RECQL | P46063 | 1/20 | 0.53 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.53 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.50 |
| ▸ | CA2 | P00918 | 2/20 | 0.50 |
| ▸ | CA3 | P07451 | 2/20 | 0.50 |
| ▸ | CA4 | P22748 | 2/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Trientine SCHEMBL241126 | 0.97 | LMNA (0.56) | LMNABLMCYP3A4NFKB1PMP22 | |
| SCHEMBL1479560 | 0.95 | LMNA (0.59) | LMNABLMCYP3A4NFKB1PMP22 | |
| SCHEMBL6247544 | 0.92 | LMNA (0.64) | LMNABLMCYP3A4NFKB1PMP22 | |
| SCHEMBL5902933 | 0.92 | LMNA (0.64) | LMNABLMCYP3A4NFKB1PMP22 | |
| SCHEMBL124979 | 0.90 | LMNA (0.61) | LMNABLMCYP3A4NFKB1PMP22 | |
| SCHEMBL28846998 | 0.90 | LMNA (0.54) | LMNABLMCYP3A4NFKB1PMP22 | |
| Trientine SCHEMBL5577006 | 0.88 | LMNA (0.58) | LMNABLMCYP3A4NFKB1PMP22 | |
| Ammonia Solution, Strong SCHEMBL3281975 | 0.88 | LMNA (0.58) | LMNABLMCYP3A4NFKB1PMP22 | |
| SCHEMBL9011764 | 0.88 | LMNA (0.58) | LMNABLMCYP3A4NFKB1PMP22 | |
| Trientine SCHEMBL3279066 | 0.86 | LMNA (0.56) | LMNABLMCYP3A4NFKB1PMP22 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114317135-B | Cleaning agent for solar silicon wafer after texturing and cleaning process thereof | 嘉兴市小辰光伏科技有限公司 | 2023-10-10 | — | — | CN | claimed |
| CN-114361290-A | Additive for removing poly-Si winding plating made of TOPCon battery and cleaning process thereof | 嘉兴市小辰光伏科技有限公司 | 2022-04-15 | — | — | CN | claimed |
| CN-114317135-A | Cleaning agent for solar silicon wafer after texturing and cleaning process thereof | 嘉兴市小辰光伏科技有限公司 | 2022-04-12 | — | — | CN | claimed |
| US-11767595-B2 | Chemical liquid, chemical liquid container, and method for treating substrate | FUJIFILM CORPORATION (JP) | 2023-09-26 | — | — | US | disclosed |
| CN-114806752-B | Single-component cleaning agent with high free alkalinity for monocrystalline large-size silicon wafer | 武汉宜田科技发展有限公司 | 2023-09-01 | — | — | CN | disclosed |
| US-20230160072-A1 | CHEMICAL LIQUID, CHEMICAL LIQUID CONTAINER, AND METHOD FOR TREATING SUBSTRATE | FUJIFILM CORPORATION (JP) | 2023-05-25 | — | — | US | disclosed |
| US-20230088854-A1 | CLEANING LIQUID AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE | FUJIFILM CORPORATION (JP) | 2023-03-23 | — | — | US | disclosed |
| US-20220403300-A1 | CLEANING LIQUID AND CLEANING METHOD | FUJIFILM CORPORATION (JP) | 2022-12-22 | — | — | US | disclosed |
| CN-114806752-A | High-free-alkalinity single-component cleaning agent for monocrystalline large-size silicon wafer | 武汉宜田科技发展有限公司 | 2022-07-29 | — | — | CN | disclosed |
| CN-114361290-B | Additive for removing poly-Si winding plating made of TOPCon battery and cleaning process thereof | 嘉兴市小辰光伏科技有限公司 | 2022-07-15 | — | — | CN | disclosed |
| US-20220177814-A1 | CLEANING SOLUTION AND CLEANING METHOD | FUJIFILM ELECTRONIC MATERIALS CO., LTD. (JP) | 2022-06-09 | — | — | US | disclosed |
| US-20150140820-A1 | CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2015-05-21 | — | — | US | disclosed |
| EP-2843689-A1 | CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATES AND METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE SURFACE | Wako Pure Chemical Industries, Ltd. (JP) | 2015-03-04 | — | — | EP | disclosed |
| US-8900371-B2 | Cleaning agent for substrate and cleaning method | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2014-12-02 | — | — | US | disclosed |
| US-20120000485-A1 | CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2012-01-05 | — | — | US | disclosed |
| US-20070235061-A1 | Cleaning Agent for Substrate and Cleaning Method | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 2007-10-11 | — | — | US | disclosed |
| EP-1679361-A1 | CLEANING AGENT FOR SUBSTRATE AND CLEANING METHOD | Wako Pure Chemical Industries, Ltd. (JP) | 2006-07-12 | — | — | EP | disclosed |
| US-20050204639-A1 | Polishing composition and polishing method | FUJIMI INCORPORATED (JP) | 2005-09-22 | — | — | US | disclosed |
| US-20050205837-A1 | Polishing composition and polishing method | FUJIMI INCORPORATED (JP) | 2005-09-22 | — | — | US | disclosed |
| EP-0375615-A2 | Method of treating water containing fertilisers | CIBA-GEIGY AG (CH) | 1990-06-27 | — | — | EP | disclosed |