SCHEMBL243615

SCHEMBL243615

C=CCOCC(C)OC(C)=O

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.42
CHRM2 P08172 1/20 0.42
CHRM4 P08173 1/20 0.42
CHRM1 P11229 1/20 0.42
TBXA2R P21731 1/20 0.42
CA1 P00915 4/20 0.41
CA2 P00918 4/20 0.41
CA7 P43166 3/20 0.41
MAPT P10636 3/20 0.41
SMN1; SMN2 Q16637 3/20 0.41
GALR3 O60755 1/20 0.41
BLM P54132 1/20 0.41
CA9 Q16790 3/20 0.38
TDP1 Q9NUW8 2/20 0.38
CA4 P22748 2/20 0.33
USP2 O75604 2/20 0.32
CYP3A4 P08684 2/20 0.32
LMNA P02545 1/20 0.32
RECQL P46063 1/20 0.32
ALOX15 P16050 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetaldehyde SCHEMBL11123828 0.95 TSHR (0.39) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL562466 0.93 TSHR (0.38) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL170338 0.93 TSHR (0.38) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL8606001 0.87 TSHR (0.39) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL8039306 0.86 TDP1 (0.33) TSHRCHRM2CHRM4CHRM1TBXA2R
Acetic Acid Butyl Ester SCHEMBL7174699 0.85 ALDH1A1 (0.50) TSHRMAPTSMN1; SMN2TDP1USP2
SCHEMBL7083659 0.85 CA1 (0.41) TSHRCA1CA2CA7CA9
SCHEMBL29757318 0.84 TDP1 (0.36) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL8039304 0.84 ALDH1A1 (0.36) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL2187422 0.84 TSHR (0.43) TSHRCA1CA2CA7CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2212 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118244576-A Photosensitive resin composition and cured film thereof 罗门哈斯电子材料韩国有限公司 2024-06-25 CN claimed
CN-117777455-B Fluorine-containing polysiloxane, preparation method thereof, photoresist composition and application thereof 山东同益光刻胶材料科技有限公司 2024-05-10 CN claimed
CN-117777455-A Fluorine-containing polysiloxane, preparation method thereof, photoresist composition and application thereof 山东同益光刻胶材料科技有限公司 2024-03-29 CN claimed
US-11920069-B2 Compositions containing semiconducting nanoparticles, and polymer or composite layers formed therefrom, and optical devices MERCK PATENT GMBH (DE) 2024-03-05 US claimed
CN-117624471-A Photoresist film-forming resin and preparation method thereof 广东粤港澳大湾区黄埔材料研究院 2024-03-01 CN claimed
CN-117106128-A Fluorine-containing acrylate polymer, preparation method thereof, fluorinated polymer photoresist material and application thereof 吉林大学 2023-11-24 CN claimed
US-20230343582-A1 SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-10-26 US claimed
CN-115785455-B Polyphosphate film-forming resin and photoresist composition 广东粤港澳大湾区黄埔材料研究院 2023-10-10 CN claimed
US-11746284-B2 Composition comprising a semiconducting light emitting nanoparticle MERCK PATENT GMBH (DE) 2023-09-05 US claimed
US-11728161-B2 Spin on carbon composition and method of manufacturing a semiconductor device TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-08-15 US claimed
EP-0416873-A2 Transparent dissolution rate modifiers for photoresists HOECHST CELANESE CORPORATION (US) 1991-03-13 EP claimed
EP-0410794-A2 Maleimide containing, negative working deep UV photoresist HOECHST CELANESE CORPORATION (US) 1991-01-30 EP claimed
EP-0220645-B1 PHOTOSENSITIVE POSITIVE COMPOSITION AND PHOTORESIST MATERIAL PREPARED THEREWITH HOECHST CELANESE CORPORATION (US) 1990-09-12 EP claimed
US-4948697-A IMPROVED ODOR AND INCREASED PHTOSPEED HOECHST CELANESE CORPORATION (US) 1990-08-14 US claimed
US-4931381-A Image reversal negative working O-quinone diazide and cross-linking compound containing photoresist process with thermal curing treatment HOECHST CELANESE CORPORATION (US) 1990-06-05 US claimed
EP-0221428-B1 LIQUID FOR THE TREATMENT OF A PHOTORESIST COMPOSITION, AND PROCESS THEREFOR HOECHST CELANESE CORPORATION (US) 1989-11-23 EP claimed
US-4863827-A O-QUINONE DIAZIDE AMERICAN HOECHST CORPORATION (US) 1989-09-05 US claimed
EP-0226741-B1 PROCESS FOR PRODUCING A POSITIVE PHOTORESIST HOECHST CELANESE CORPORATION (US) 1989-08-02 EP claimed
EP-0260994-A2 Process for producing integrated circuit JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1988-03-23 EP claimed
US-4550069-A PHOTOSPEED INCREASED AMERICAN HOECHST CORPORATION (US) 1985-10-29 US claimed