SCHEMBL24677399

SCHEMBL24677399

CC(O)c1ccc(OCCOCCOCC2CO2)cc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.42
TSHR P16473 4/20 0.42
TP53 P04637 3/20 0.42
KMT2A Q03164 3/20 0.42
MAPT P10636 2/20 0.42
HPGD P15428 2/20 0.42
MEN1 O00255 2/20 0.42
HIF1A Q16665 2/20 0.42
CYP1A2 P05177 1/20 0.42
PPARG P37231 1/20 0.42
SMN1; SMN2 Q16637 2/20 0.41
TDP1 Q9NUW8 2/20 0.41
PKM P14618 2/20 0.39
LMNA P02545 1/20 0.39
GAA P10253 1/20 0.39
CYP3A4 P08684 1/20 0.36
GLA P06280 1/20 0.35
KDM4E B2RXH2 1/20 0.35
RECQL P46063 1/20 0.35
HRH3 Q9Y5N1 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22005160 1.00 ALDH1A1 (0.42) ALDH1A1TSHRTP53KMT2AMAPT
SCHEMBL22004256 0.92 SMN1; SMN2 (0.49) ALDH1A1TSHRTP53KMT2AMAPT
SCHEMBL6437264 0.85 ALDH1A1 (0.57) ALDH1A1TSHRTP53KMT2AMAPT
SCHEMBL9325190 0.83 TDP1 (0.55) ALDH1A1TSHRTP53KMT2AMAPT
SCHEMBL10700448 0.82 TSHR (0.41) ALDH1A1TSHRTP53KMT2AMAPT
SCHEMBL28630370 0.82 SMN1; SMN2 (0.46) ALDH1A1TSHRTP53KMT2AMAPT
SCHEMBL22004487 0.82 KDM4E (0.49) ALDH1A1TSHRTP53KMT2AMAPT
SCHEMBL11950258 0.81 ALDH1A1 (0.47) ALDH1A1TSHRTP53KMT2AMAPT
SCHEMBL25015205 0.79 TDP1 (0.47) ALDH1A1TSHRTP53KMT2AMAPT
SCHEMBL28630372 0.79 ALDH1A1 (0.49) ALDH1A1TSHRTP53KMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4036174-A1 COMPOSITION FOR FORMING HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE WITH HEAT-CONDUCTING LAYER FUJIFILM Corporation (JP) 2022-08-03 EP disclosed