SCHEMBL22004487

SCHEMBL22004487

Cc1cc(OCCOCCOCC2CO2)ccc1C(C)O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 5/20 0.49
HTT P42858 1/20 0.49
KMT2A Q03164 5/20 0.41
MEN1 O00255 3/20 0.41
SMN1; SMN2 Q16637 3/20 0.41
ALDH1A1 P00352 4/20 0.39
TP53 P04637 3/20 0.39
TSHR P16473 3/20 0.39
HIF1A Q16665 2/20 0.39
CYP3A4 P08684 1/20 0.39
CARM1 Q86X55 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.38
FKBP1A P62942 1/20 0.37
TDP1 Q9NUW8 3/20 0.37
MAPT P10636 2/20 0.36
HPGD P15428 2/20 0.36
CYP1A2 P05177 1/20 0.36
PPARG P37231 1/20 0.36
LMNA P02545 1/20 0.36
GAA P10253 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22005626 0.83 ALDH1A1 (0.46) KDM4EHTTKMT2AMEN1SMN1; SMN2
SCHEMBL22005160 0.82 ALDH1A1 (0.42) KDM4EKMT2AMEN1SMN1; SMN2ALDH1A1
SCHEMBL24677399 0.82 ALDH1A1 (0.42) KDM4EKMT2AMEN1SMN1; SMN2ALDH1A1
SCHEMBL11967031 0.78 LMNA (0.42) KDM4ESMN1; SMN2ALDH1A1TP53TSHR
SCHEMBL11950258 0.77 ALDH1A1 (0.47) KDM4EKMT2AMEN1SMN1; SMN2ALDH1A1
SCHEMBL9325190 0.76 TDP1 (0.55) KDM4EKMT2AMEN1SMN1; SMN2ALDH1A1
SCHEMBL3143622 0.76 ALDH1A1 (0.56) KDM4EHTTKMT2AMEN1SMN1; SMN2
SCHEMBL10700448 0.75 TSHR (0.41) KMT2AMEN1SMN1; SMN2ALDH1A1TP53
SCHEMBL28630372 0.75 ALDH1A1 (0.49) KDM4EKMT2AMEN1SMN1; SMN2ALDH1A1
SCHEMBL25907878 0.75 KDM4E (0.72) KDM4EHTTKMT2AMEN1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4036174-A1 COMPOSITION FOR FORMING HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE WITH HEAT-CONDUCTING LAYER FUJIFILM Corporation (JP) 2022-08-03 EP disclosed
EP-4024445-A1 COMPOSITION FOR FORMING HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE WITH HEAT-CONDUCTING LAYER FUJIFILM Corporation (JP) 2022-07-06 EP disclosed
EP-3653575-A1 SURFACE-MODIFIED INORGANIC NITRIDE, COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE PROVIDED WITH THERMALLY CONDUCTIVE LAYER FUJIFILM Corporation (JP) 2020-05-20 EP disclosed