Boric Acid

Boric Acid

SCHEMBL2482071

OB(O)O.[AlH3].[PbH2]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Boric Acid SCHEMBL10525257 0.93
Boric Acid SCHEMBL10525955 0.93
Boric Acid SCHEMBL28900283 0.91 LMNA (0.80)
Boric Acid SCHEMBL130282 0.91
Boric Acid SCHEMBL35906 0.91
Boric Acid SCHEMBL11680680 0.91 LMNA (0.80)
Boric Acid SCHEMBL9779988 0.91
Boric Acid SCHEMBL25337266 0.83
Boric Acid SCHEMBL2484094 0.83 LMNA (0.67)
Boric Acid SCHEMBL15710311 0.83 LMNA (0.67)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105415696-B The method and improvement substrate of preparation improvement substrate 普立万公司 2019-01-15 CN claimed
CN-106458579-A Hydrogenation of oxidized molecules from biomass refining 威尔迪亚公司 2017-02-22 CN claimed
CN-102015259-B Composite coated substrate and moldable composite 普立万公司 2016-10-26 CN claimed
US-4767738-A OXIDATION CATALYST AMOCO CORPORATION (US) 1988-08-30 US claimed
CN-113399117-B Progressive dust-holding electrostatic filter cotton with good adsorption performance 杭州诗蓝过滤科技有限公司 2023-12-19 CN disclosed
CN-105415696-B The method and improvement substrate of preparation improvement substrate 普立万公司 2019-01-15 CN disclosed
CN-106458579-A Hydrogenation of oxidized molecules from biomass refining 威尔迪亚公司 2017-02-22 CN disclosed
CN-102015259-B Composite coated substrate and moldable composite 普立万公司 2016-10-26 CN disclosed
CN-105415696-A method for preparing improved substrate and improved substrate POLYSTRAND INC 2016-03-23 CN disclosed
EP-1786250-B1 Composite wiring board and manufacturing method thereof TDK CORP (JP) 2011-10-19 EP disclosed
CN-102015259-A Composite coated substrate and moldable composite POLYSTRAND INC 2011-04-13 CN disclosed
US-7733663-B2 Multilayer ceramic substrate TDK CORPORATION (JP) 2010-06-08 US disclosed
US-20070108586-A1 Composite wiring board and manufacturing method thereof TDK CORPORATION (JP) 2007-05-17 US disclosed
EP-1786250-A1 Composite wiring board and manufacturing method thereof TDK Corporation (JP) 2007-05-16 EP disclosed
EP-1720203-A2 Multilayer ceramic substrate and production method thereof TDK Corporation (JP) 2006-11-08 EP disclosed
CN-1856216-A Multilayer ceramic substrate and production method thereof TDK CORP (JP) 2006-11-01 CN disclosed
US-20060234023-A1 Multilayer ceramic substrate and production method thereof TDK CORPORATION (JP) 2006-10-19 US disclosed
US-4767738-A OXIDATION CATALYST AMOCO CORPORATION (US) 1988-08-30 US disclosed
US-4767738-A OXIDATION CATALYST AMOCO CORPORATION (US) 1988-08-30 US disclosed
US-4767738-A OXIDATION CATALYST AMOCO CORPORATION (US) 1988-08-30 US disclosed