SCHEMBL2484592

SCHEMBL2484592

CCCOC(C)C(O[SiH3])(OCCC)OCCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL430959 0.84
SCHEMBL3629253 0.83
SCHEMBL4169829 0.79
SCHEMBL3629249 0.79
SCHEMBL229357 0.74 LMNA (0.36)
SCHEMBL448849 0.74
SCHEMBL27886693 0.73 HSD17B10 (0.31)
SCHEMBL9687733 0.72
SCHEMBL1560656 0.70
SCHEMBL1560871 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5013585-A Method for the preparation of surface-modified silica particles SHIN-ETSU CHEMICAL CO., LTD. (JP) 1991-05-07 US claimed
EP-4208515-B1 UV/MOISTURE DUAL CURE COMPOSITION WITH ENHANCED SUBSTRATE ADHESION DOW SILICONES CORP (US) 2024-08-28 EP disclosed
US-11820896-B2 UV/moisture dual cure composition with enhanced substrate adhesion DOW GLOBAL TECHNOLOGIES LLC (US) 2023-11-21 US disclosed
EP-4208515-A1 UV/MOISTURE DUAL CURE COMPOSITION WITH ENHANCED SUBSTRATE ADHESION Dow Silicones Corporation (US) 2023-07-12 EP disclosed
US-20230193029-A1 UV/MOISTURE DUAL CURE COMPOSITION WITH ENHANCED SUBSTRATE ADHESION DOW SILICONES CORPORATION 2023-06-22 US disclosed
WO-2022051207-A1 UV/MOISTURE DUAL CURE COMPOSITION WITH ENHANCED SUBSTRATE ADHESION DOW SILICONES CORPORATION (US) 2022-03-10 WO disclosed
EP-3339960-B1 CHARGING MEMBER, METHOD OF PRODUCING CHARGING MEMBER, PROCESS CARTRIDGE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS CANON KK (JP) 2019-08-21 EP disclosed
US-10365576-B2 Charging member, method for producing charging member, process cartridge and electrophotographic image forming apparatus CANON KABUSHIKI KAISHA (JP) 2019-07-30 US disclosed
EP-3339960-A1 CHARGING MEMBER, METHOD OF PRODUCING CHARGING MEMBER, PROCESS CARTRIDGE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS Canon Kabushiki Kaisha (JP) 2018-06-27 EP disclosed
US-20180173129-A1 CHARGING MEMBER, METHOD FOR PRODUCING CHARGING MEMBER, PROCESS CARTRIDGE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS CANON KABUSHIKI KAISHA (JP) 2018-06-21 US disclosed
EP-1762602-A1 AQUEOUS COATING COMPOSITION Dainippon Ink and Chemicals, Incorporated (JP) 2007-03-14 EP disclosed
US-6773758-B2 SATURATED HYDROCARBON POLYMER HAVING AT LEAST ONE ALKENYL GROUP PER MOLECULE, SILANE COUPLING AGENT, POLYVALENT ALKOXYSILANE, AND ORGANOALUMINUM AND/OR ORGANOTITANIUM COMPOUND KANEKA CORPORATION (JP) 2004-08-10 US disclosed
US-6664343-B2 Stable against environmental moisture change, fast curing, flexibility, heat resistance MITSUI CHEMICALS, INC. (JP) 2003-12-16 US disclosed
US-20020137844-A1 Phenolic resin composition GUN EI CHEMICAL INDUSTRY CO., LTD. (JP) 2002-09-26 US disclosed
US-20020048680-A1 Primer composition and bonding method KANEKA CORPORATION (JP) 2002-04-25 US disclosed
EP-1096314-A1 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2001-05-02 EP disclosed
EP-1022323-A1 SURFACE TREATMENT COMPOSITION, METHOD OF SURFACE TREATMENT, SUBSTRATE, AND ARTICLE ASAHI GLASS COMPANY LTD. (JP) 2000-07-26 EP disclosed
US-5236997-A Curable fluorosilicone rubber composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 1993-08-17 US disclosed
US-5039736-A Hydroxy-terminated polysiloxane, surface treated hydrophobic silica filler, hexamethyldisilazane, hydrolyzable organosilane compound; good mold releasability SHIN-ETSU CHEMICAL CO., LTD. (JP) 1991-08-13 US disclosed
US-5013585-A Method for the preparation of surface-modified silica particles SHIN-ETSU CHEMICAL CO., LTD. (JP) 1991-05-07 US disclosed