SCHEMBL2488022

SCHEMBL2488022

C=CC(=O)OC(Cn1c(=O)[nH]c(=O)[nH]c1=O)(OC(=O)C=C)OC(=O)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7028000 0.86
SCHEMBL152169 0.79 TSHR (0.39)
SCHEMBL9342186 0.79 NPSR1 (0.31)
SCHEMBL3676797 0.76 TSHR (0.31)
SCHEMBL16227843 0.75 TSHR (0.32)
SCHEMBL5585810 0.75 APEX1 (0.31)
SCHEMBL21816726 0.75 TSHR (0.38)
SCHEMBL28986659 0.73
SCHEMBL17938184 0.73 APEX1 (0.31)
SCHEMBL3779899 0.73 APEX1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 106 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-2034620-A None JP disclosed
JP-2144505-A None JP disclosed
JP-62290705-A None JP disclosed
CN-114381155-B Electron beam curable coating composition 丰田自动车株式会社 2024-06-14 CN disclosed
CN-115612000-A Infrared light sensitive photo-curing composition 保定乐凯新材料股份有限公司 2023-01-17 CN disclosed
US-11535766-B2 Curable composition for inkjet printing, cured product of same, and electronic component having the cured product TAIYO INK MFG. CO., LTD. (JP) 2022-12-27 US disclosed
CN-115362184-A Curable composition, cured product, and electronic component 太阳油墨制造株式会社 2022-11-18 CN disclosed
CN-114153122-A Cationic free radical polymerization composition for preparing LDI dry film and LDI dry film 保定乐凯新材料股份有限公司 2022-03-08 CN disclosed
CN-114149530-A Alkali-soluble polymer for preparing LDI dry film and preparation method thereof 保定乐凯新材料股份有限公司 2022-03-08 CN disclosed
EP-3778793-A1 CURABLE COMPOSITION FOR INKJET PRINTING, CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT HAVING THE CURED PRODUCT Taiyo Ink Mfg. Co., Ltd. (JP) 2021-02-17 EP disclosed
JP-H02144505-A METHOD FOR REMOVING WIRE ROD COATING SUMITOMO ELECTRIC IND LTD 1990-06-04 JP disclosed
US-4920037-A Printed circuits MITSUBISHI KASEI CORPORATION (JP) 1990-04-24 US disclosed
JP-H0234620-A PHOTOCURABLE RESIN COMPOSITION MITSUI TOATSU CHEM INC 1990-02-05 JP disclosed
EP-0301733-A1 Photocuring resin compositions MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-02-01 EP disclosed
EP-0167042-B1 CURABLE RESIN COMPOSITIONS Takeda Chemical Industries, Ltd. (JP) 1988-09-21 EP disclosed
JP-S62290705-A PHOTOPOLYMERIZABLE COMPOSITION MITSUBISHI CHEM IND LTD 1987-12-17 JP disclosed
EP-0249468-A2 Photopolymerizable composition MITSUBISHI KASEI CORPORATION (JP) 1987-12-16 EP disclosed
EP-0223217-A2 Stabilized resin solutions Takeda Chemical Industries, Ltd. (JP) 1987-05-27 EP disclosed
US-4613652-A Curable resin compositions TAKEDA CHEMICAL INDUSTRIES, INC. (JP) 1986-09-23 US disclosed
EP-0167042-A1 Curable resin compositions Takeda Chemical Industries, Ltd. (JP) 1986-01-08 EP disclosed