SCHEMBL5585810

SCHEMBL5585810

C=CC(=O)C(Cn1c(=O)[nH]c(=O)[nH]c1=O)(C(=O)C=C)C(=O)C=C

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
APEX1 P27695 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27870624 0.81
SCHEMBL2488022 0.75
SCHEMBL3779899 0.73 APEX1 (0.31) APEX1
SCHEMBL7028000 0.73
SCHEMBL11007936 0.73 GAA (0.31)
SCHEMBL152169 0.70 TSHR (0.39)
SCHEMBL125274 0.70 APEX1 (0.33) APEX1
SCHEMBL27487067 0.69 APEX1 (0.43) APEX1
Acrylic Acid SCHEMBL4887834 0.69 LMNA (0.37) APEX1
SCHEMBL28188715 0.68 APEX1 (0.39) APEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7208539-B2 Thermosetting resin composition, and prepreg and laminated board using the same HITACHI CHEMICAL CO., LTD. (JP) 2007-04-24 US disclosed
US-7078106-B2 Thermosetting resin composition and use thereof HITACHI CHEMICAL CO., LTD (JP) 2006-07-18 US disclosed
US-20050234173-A1 Thermosetting resin composition and prepreg and laminated sheet using the same HITACHI CHEMICAL CO., LTD. (JP) 2005-10-20 US disclosed
EP-0859085-B1 METHOD OF REPAIRING/REINFORCING EXISTING STRUCTURES AND ANISOTROPIC WOVEN FABRICS USED THEREFOR MITSUBISHI RAYON CO (JP) 2005-03-16 EP disclosed
EP-1229079-B1 Thermosetting resin composition and use thereof HITACHI CHEMICAL CO LTD (JP) 2004-09-01 EP disclosed
US-20040091726-A1 Thermosetting resin composition and use thereof TSUCHIKAWA SHINJI (JP) 2004-05-13 US disclosed
US-6667107-B2 Heat resistance; waterproofing HITACHI CHEMICAL CO., LTD. (JP) 2003-12-23 US disclosed
US-20020147277-A1 Thermosetting resin composition and use thereof HITACHI CHEMICAL CO., LTD. (JP) 2002-10-10 US disclosed
EP-1229079-A1 Thermosetting resin composition and use thereof Hitachi Chemical Co., Ltd. (JP) 2002-08-07 EP disclosed
US-6387479-B1 Method of repairing/reinforcing existing structures and anisotropic woven fabrics used therefor MITSUBISHI RAYON CO., LTD. (JP) 2002-05-14 US disclosed
US-20010004492-A1 Repair and reinforcement method for preexisting structures and an anisotropic textile used therefor MITSUBUSHI RAYON CO., LTD. (JP) 2001-06-21 US disclosed
EP-0859085-A1 METHOD OF REPAIRING/REINFORCING EXISTING STRUCTURES AND ANISOTROPIC WOVEN FABRICS USED THEREFOR MITSUBISHI RAYON CO., LTD. (JP) 1998-08-19 EP disclosed