SCHEMBL25068834

SCHEMBL25068834

CC(C)(C)CC(C)(C(=O)Oc1ccc(O)c(C(C)(C)C)c1)C(C)(C)C

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ATM Q13315 2/20 0.53
▸ GAA P10253 2/20 0.53
▸ XBP1 P17861 1/20 0.53
▸ NPSR1 Q6W5P4 1/20 0.53
▸ L3MBTL1 Q9Y468 1/20 0.53
▸ NR1H4 Q96RI1 7/20 0.51
▸ POLB P06746 1/20 0.49
▸ MAPT P10636 1/20 0.49
▸ ESRRA P11474 3/20 0.48
▸ ALDH1A1 P00352 3/20 0.48
▸ NR1I2 O75469 1/20 0.44
▸ LMNA P02545 1/20 0.44
▸ CYP2C9 P11712 1/20 0.44
▸ MIF P14174 1/20 0.44
▸ TYR P14679 1/20 0.44
▸ ALOX15 P16050 1/20 0.44
▸ HTT P42858 1/20 0.44
▸ NFE2L2 Q16236 1/20 0.44
▸ HSD17B10 Q99714 1/20 0.44
▸ HSP90AA1 P07900 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23762903 0.87 ATM (0.40) ATMGAAXBP1NPSR1L3MBTL1
SCHEMBL24405188 0.87 ELANE (0.40) ATMGAAXBP1NPSR1L3MBTL1
SCHEMBL24861537 0.85 ATM (0.58) ATMGAAXBP1NPSR1L3MBTL1
SCHEMBL12058674 0.81 ELANE (0.51) ALDH1A1LMNA
SCHEMBL18157016 0.81 NR1H4 (0.60) ATMGAAXBP1NPSR1L3MBTL1
SCHEMBL12058542 0.78 CYP3A4 (0.54) POLBLMNA
SCHEMBL16544029 0.78 ATM (0.56) ATMGAAXBP1NPSR1L3MBTL1
SCHEMBL21776169 0.78 KCNJ11 (0.38) ATMGAAXBP1NPSR1L3MBTL1
SCHEMBL24405004 0.78 ELANE (0.40) ATMGAAXBP1NPSR1L3MBTL1
SCHEMBL25515127 0.77 MAOB (0.42) MAPTALDH1A1NR1I2LMNACYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230059089-A1 MATERIAL FOR FORMING ADHESIVE FILM, METHOD FOR FORMING ADHESIVE FILM USING THE SAME, AND PATTERNING PROCESS USING MATERIAL FOR FORMING ADHESIVE FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-02-23 — — US disclosed
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