SCHEMBL2517427

SCHEMBL2517427

C=C(CC1CCCC1)C(=O)OCC

nearest known ligand 0.40

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.40
TSHR P16473 1/20 0.40
MAPT P10636 2/20 0.37
TDP1 Q9NUW8 1/20 0.36
THRB P10828 1/20 0.36
ATM Q13315 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
KMT2A Q03164 2/20 0.35
HPGD P15428 2/20 0.35
EPHX1 P07099 1/20 0.35
GAA P10253 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2987389 0.98 ALDH1A1 (0.39) ALDH1A1TSHRMAPTTDP1THRB
SCHEMBL16267586 0.82 TSHR (0.44) ALDH1A1TSHRATMHPGDEPHX1
SCHEMBL27928142 0.81 KMT2A (0.41) ALDH1A1TSHRMAPTL3MBTL1KMT2A
SCHEMBL4590410 0.81 ALDH1A1 (0.39) ALDH1A1TSHRMAPTTDP1THRB
SCHEMBL11019910 0.80 CYP1A2 (0.40) ALDH1A1TSHRTHRBATML3MBTL1
SCHEMBL17159431 0.79 EPHX1 (0.44) ALDH1A1TSHRMAPTKMT2AHPGD
SCHEMBL4737887 0.79 ALDH1A1 (0.41) ALDH1A1MAPTTDP1THRBATM
SCHEMBL5072105 0.79 EPHX1 (0.44) ALDH1A1TSHRMAPTKMT2AHPGD
SCHEMBL4960125 0.79 LMNA (0.45) ALDH1A1TSHRMAPTTHRBATM
SCHEMBL11018589 0.78 CYP1A2 (0.43) THRBATML3MBTL1EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9840568-B2 Polymer and method for producing same MITSUBISHI CHEMICAL CORPORATION (JP) 2017-12-12 US claimed
CN-115725015-A KrF resin, process for producing the same, and chemically amplified photoresist 阜阳欣奕华材料科技有限公司 2023-03-03 CN disclosed
CN-115595094-A Acrylate adhesive, adhesive tape, preparation method and application thereof 广东新之源技术有限公司(CN) 2023-01-13 CN disclosed
CN-110184006-B Thermal-stripping adhesive and preparation method thereof 广东硕成科技有限公司 2021-06-15 CN disclosed
CN-110184006-B Thermal-stripping adhesive and preparation method thereof 广东硕成科技有限公司 2021-06-15 CN disclosed
US-9840568-B2 Polymer and method for producing same MITSUBISHI CHEMICAL CORPORATION (JP) 2017-12-12 US disclosed
CN-101547895-B Photoactive compounds AZ ELECTRONIC MATERIALS USA 2014-12-03 CN disclosed
US-20140114034-A1 POLYMER AND METHOD FOR PRODUCING SAME MITSUBISHI RAYON CO., LTD. (JP) 2014-04-24 US disclosed
CN-102161637-B Photoactive compound AZ ELECTRONIC MATERIALS USA 2013-03-13 CN disclosed
CN-102161635-B Photoactive compound AZ ELECTRONIC MATERIALS USA 2013-01-02 CN disclosed
CN-101981501-A A photoresist image-forming process using double patterning AZ ELECTRONIC MATERIALS USA 2011-02-23 CN disclosed
CN-101981509-A Process for reducing dimensions between photoresist patterns including a pattern hardening step AZ ELECTRONIC MATERIALS USA 2011-02-23 CN disclosed
CN-101636421-A Can be used for polymkeric substance in the photo-corrosion-resisting agent composition and its composition AZ ELECTRONIC MATERIALS USA 2010-01-27 CN disclosed
US-20090253074-A1 FLUORINATED POLYMERS FOR USE IN IMMERSION LITHOGRAPHY E. I. DU PONT DE NEMOURS AND COMPANY 2009-10-08 US disclosed
CN-101547895-A Photoactive compounds AZ ELECTRONIC MATERIALS USA (US) 2009-09-30 CN disclosed
CN-101547913-A Photoactive compounds AZ ELECTRONIC MATERIALS USA (US) 2009-09-30 CN disclosed
CN-101310223-A Photoactive compounds AZ ELECTRONIC MATERIALS USA (US) 2008-11-19 CN disclosed
WO-2008021291-A2 FLUORINATED POLYMERS FOR USE IN IMMERSION LITHOGRAPHY E. I. DU PONT DE NEMOURS AND COMPANY (US) 2008-02-21 WO disclosed
EP-1693707-A1 Positive resist composition, and patterning process using the same Shinetsu Chemical Co., Ltd. (JP) 2006-08-23 EP disclosed
US-20060183051-A1 Positive resist composition, and patterning process using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-08-17 US disclosed