SCHEMBL2518541

SCHEMBL2518541

CCCC(C)[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL6160569 0.96
SCHEMBL28659923 0.79
SCHEMBL2514788 0.79
SCHEMBL18014674 0.76 TSHR (0.31)
SCHEMBL861682 0.76
SCHEMBL16497347 0.74
SCHEMBL8519345 0.74 OPRM1 (0.50)
SCHEMBL6049088 0.74 OPRM1 (0.50)
SCHEMBL7259736 0.72
SCHEMBL2597783 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12414388-B2 Epitaxial silicon wafer, method for producing same, and method for producing semiconductor device SUMCO CORPORATION (JP) 2025-09-09 US disclosed
WO-2024176711-A1 EPITAXIAL SILICON WAFER, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 株式会社SUMCO 2024-08-29 WO disclosed
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
CN-116891572-A Metal removing method for polysilane compound 日产化学株式会社 2023-10-17 CN disclosed
US-20230317761-A1 EPITAXIAL SILICON WAFER, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE SUMCO CORPORATION (JP) 2023-10-05 US disclosed
US-20230257503-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE MITSUBISHI CHEMICAL CORPORATION (JP) 2023-08-17 US disclosed
EP-4212256-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE Mitsubishi Chemical Corporation (JP) 2023-07-19 EP disclosed
US-11542397-B2 Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-03 US disclosed
CN-114999910-A Directed deposition on patterned structures 朗姆研究公司 2022-09-02 CN disclosed
US-11413682-B2 Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid TOKYO OHKA KOGYO CO., LTD. (JP) 2022-08-16 US disclosed
EP-0957794-B1 BRANCHED STRUCTURES FOR SUPPORTING MULTIPLE ELECTRODE ELEMENTS BOSTON SCIENT LTD (BB) 2007-07-18 EP disclosed
EP-0575111-B1 Polymeric insulating material and formed article making use of the material MITSUI CHEMICALS INC (JP) 2005-02-16 EP disclosed
EP-1261613-B1 GASTRO-SPECIFIC PRODRUGS PHARMACIA CORP (US) 2004-05-06 EP disclosed
EP-1261613-A1 GASTRO-SPECIFIC PRODRUGS Pharmacia Corporation (US) 2002-12-04 EP disclosed
US-6413945-B1 REACTION PRODUCT OF ORGANOSILICON COMPOUNDS AND DRUG; ANTIULCER AGENTS PHARMACIA CORPORATION 2002-07-02 US disclosed
WO-2001064690-A1 GASTRO-SPECIFIC PRODRUGS PHARMACIA CORPORATION (US) 2001-09-07 WO disclosed
US-6030959-A FOR TREATMENT AND PROPHYLAXIS OF GASTRIC ULCERS MONSANTO COMPANY (US) 2000-02-29 US disclosed
US-5573840-A Polymeric insulating material and formed article making use of the material MITSUI TOATSU CHEMICALS, INC. (JP) 1996-11-12 US disclosed
US-5476709-A Polymeric insulating material and formed article making use of the material MITSUI TOATSU CHEMICALS, INC. (JP) 1995-12-19 US disclosed
EP-0575111-A2 Polymeric insulating material and formed article making use of the material MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-12-22 EP disclosed