SCHEMBL25199700

SCHEMBL25199700

CC(C(=O)[O-])C(=O)C(C)(C)C.CC(C(=O)[O-])C(=O)C(C)(C)C.CC(C(=O)[O-])C(=O)C(C)(C)C.CC(C(=O)[O-])C(=O)C(C)(C)C.[Pt+4]

nearest known ligand 0.41

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL224098 0.95 CA1 (0.33) CA1
SCHEMBL15675938 0.95 CA1 (0.33) CA1
SCHEMBL29101304 0.95 CA1 (0.33) CA1
SCHEMBL3245383 0.95 CA1 (0.33) CA1
Acetone SCHEMBL6908729 0.88 CA1 (0.30) CA1
Acetaldehyde SCHEMBL6909031 0.84
SCHEMBL6053484 0.81
SCHEMBL1397144 0.80 CA1 (0.35) CA1
SCHEMBL30394140 0.76 TP53 (0.38)
SCHEMBL8459222 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4696748-A1 PERFLUOROPOLYETHER GEL CURABLE COMPOSITION, PERFLUOROPOLYETHER GEL CURED PRODUCT, AND ELECTRONIC COMPONENT SEALED WITH SAID CURED PRODUCT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-02-18 EP disclosed
US-11970639-B2 Temporary adhesive for wafer processing, wafer laminate and method for producing thin wafer SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-04-30 US disclosed
EP-4189155-A1 METHOD FOR COATING A TEXTILE MEDIUM Elkem Silicones France SAS (FR) 2023-06-07 EP disclosed
US-20230088354-A1 TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER LAMINATE AND METHOD FOR PRODUCING THIN WAFER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-03-23 US disclosed
EP-4144808-A1 TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER LAMINATE AND METHOD FOR PRODUCING THIN WAFER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-03-08 EP disclosed