SCHEMBL2523958

SCHEMBL2523958

CCc1cccc(S(=O)(=O)O)c1S(=O)(=O)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 4/20 0.46
GABRB2 P47870 4/20 0.46
TTR P02766 2/20 0.41
CTSB P07858 1/20 0.41
MYC P01106 1/20 0.39
SLC9A1 P19634 1/20 0.38
CYP1A2 P05177 1/20 0.38
HSD11B1 P28845 1/20 0.37
HSD17B10 Q99714 2/20 0.36
LMNA P02545 1/20 0.36
HPGD P15428 1/20 0.36
HIF1A Q16665 1/20 0.36
DAO P14920 1/20 0.35
DDO Q99489 1/20 0.35
FABP4 P15090 2/20 0.34
FABP3 P05413 1/20 0.34
FABP5 Q01469 1/20 0.34
RAPGEF4 Q8WZA2 1/20 0.34
CCNA2 P20248 1/20 0.34
CDK2 P24941 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11687538 0.89 GABRA1 (0.52) GABRA1GABRB2CTSBSLC9A1DAO
Hydrochloric Acid SCHEMBL27327616 0.87 GABRA1 (0.50) GABRA1GABRB2CTSBSLC9A1DAO
SCHEMBL2528805 0.86 TTR (0.38) GABRA1GABRB2TTRCTSBMYC
SCHEMBL12820004 0.84 TTR (0.56) GABRA1GABRB2TTRCTSBMYC
SCHEMBL2527949 0.83 BID (0.40) TTR
SCHEMBL29394818 0.83 CTSB (0.52) GABRA1GABRB2TTRCTSBMYC
SCHEMBL34582 0.83 CTSB (0.52) GABRA1GABRB2TTRCTSBMYC
SCHEMBL16563102 0.82 BID (0.45) HSD17B10KDM4E
SCHEMBL3367748 0.82 GABRA1 (0.45) GABRA1GABRB2TTRCTSBMYC
SCHEMBL1607448 0.82 GABRA1 (0.45) GABRA1GABRB2SLC9A1HSD17B10HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20150125985-A1 ETCHING FLUID AND PRODUCTION METHOD FOR SILICON-BASED SUBSTRATE USING SAME WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2015-05-07 US disclosed
EP-2849211-A1 ETCHING FLUID AND PRODUCTION METHOD FOR SILICON-BASED SUBSTRATE USING SAME Wako Pure Chemical Industries, Ltd. (JP) 2015-03-18 EP disclosed
EP-2671903-A1 METHOD FOR PRODUCING RESIN FILM USING ELECTROCONDUCTIVE RESIN COMPOSITION Nitto Denko Corporation (JP) 2013-12-11 EP disclosed
US-20130320268-A1 METHOD FOR PRODUCING RESIN FILM USING ELECTROCONDUCTIVE RESIN COMPOSITION NITTO DENKO CORPORATION (JP) 2013-12-05 US disclosed
CN-103339169-A Method for producing resin film using electroconductive resin composition NITTO DENKO CORP 2013-10-02 CN disclosed
US-8039057-B2 Forming a polyimide compound containing a polymeric conductive agent into a film shape; exposing the film to high temperature and humidity FUJI XEROX CO., LTD. (JP) 2011-10-18 US disclosed
US-7593676-B2 Image-forming apparatus with improved intermediate transfer body FUJI XEROX CO., LTD. (JP) 2009-09-22 US disclosed
US-20080280226-A1 Polyimide film, image-forming apparatus, method for producing the polyimide film, and method for producing the intermediate transfer belt FUJI XEROX CO., LTD. (JP) 2008-11-13 US disclosed
US-20080107457-A1 Image-forming apparatus FUJI XEROX CO., LTD. (JP) 2008-05-08 US disclosed
US-20070025740-A1 Intermediate transfer belt, production method thereof, and image-forming device using the intermediate transfer belt FUJI XEROX CO., LTD. (JP) 2007-02-01 US disclosed
US-20050214554-A1 Polyimide film, image-forming apparatus, method for producing the polyimide film, and method for producing the intermediate transfer belt FUJI XEROX CO., LTD. (JP) 2005-09-29 US disclosed
US-5436796-A Polyaniline in undoped state, second polymer having ester or amide groups, protonic acid NITTO DENKO CORPORATION (JP) 1995-07-25 US disclosed