SCHEMBL25256889

SCHEMBL25256889

CCCC([SiH3])C([SiH3])C[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7573807 0.71
SCHEMBL7599384 0.69 LMNA (0.40)
SCHEMBL23701309 0.67
SCHEMBL2597783 0.65
SCHEMBL7259736 0.65
SCHEMBL23701052 0.62
SCHEMBL23701240 0.62
SCHEMBL23701290 0.62
SCHEMBL2518541 0.62
SCHEMBL7632700 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12595587-B2 Method and a substrate processing apparatus for forming an epitaxial stack on a plurality of substrates ASM IP HOLDING B.V. (NL) 2026-04-07 US disclosed
US-20260092399-A1 METHOD FOR FORMING AN EPITAXIAL STRUCTURE ONTO A SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS ASM IP HOLDING BV (NL) 2026-04-02 US disclosed
US-12387930-B2 Method and wafer processing furnace for forming an epitaxial stack of semiconductor epitaxial layers on a plurality of substrates ASM IP HOLDING B.V. (NL) 2025-08-12 US disclosed
US-12362174-B2 Method and wafer processing furnace for forming an epitaxial stack on a plurality of substrates ASM IP HOLDING B.V. (NL) 2025-07-15 US disclosed
US-20240026567-A1 METHOD AND A SUBSTRATE PROCESSING APPARATUS FOR FORMING AN EPITAXIAL STACK ON A PLURALITY OF SUBSTRATES ASM IP HOLDING B.V. (NL) 2024-01-25 US disclosed
US-20230223255-A1 METHOD AND WAFER PROCESSING FURNACE FOR FORMING AN EPITAXIAL STACK ON A PLURALITY OF SUBSTRATES ASM IP HOLDING B.V. (NL) 2023-07-13 US disclosed
US-20230223258-A1 METHOD AND WAFER PROCESSING FURNACE FOR FORMING AN EPITAXIAL STACK OF SEMICONDUCTOR EPITAXIAL LAYERS ASM IP HOLDING B.V. (NL) 2023-07-13 US disclosed