SCHEMBL25265019

SCHEMBL25265019

CCCCCCCCCCCC(C)CCCCCCC(N)N

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 1/20 0.56
SPHK1 Q9NYA1 2/20 0.52
ACE2 Q9BYF1 1/20 0.52
DNM1 Q05193 2/20 0.46
TP53 P04637 2/20 0.45
LMNA P02545 3/20 0.43
CYP2D6 P10635 2/20 0.43
PLA2G1B P04054 1/20 0.43
PLA2G2A P14555 1/20 0.43
GMNN O75496 1/20 0.43
POLB P06746 1/20 0.43
THPO P40225 1/20 0.43
MTOR P42345 1/20 0.43
BLM P54132 1/20 0.43
KDM4E B2RXH2 1/20 0.43
CYP1A2 P05177 1/20 0.43
CYP3A4 P08684 1/20 0.43
MAPT P10636 1/20 0.43
CETP P11597 1/20 0.43
HTT P42858 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25264605 1.00 OPRM1 (0.56) OPRM1SPHK1ACE2DNM1TP53
SCHEMBL25181285 1.00 OPRM1 (0.56) OPRM1SPHK1ACE2DNM1TP53
SCHEMBL29461275 1.00 OPRM1 (0.56) OPRM1SPHK1ACE2DNM1TP53
SCHEMBL25187043 1.00 OPRM1 (0.56) OPRM1SPHK1ACE2DNM1TP53
SCHEMBL29461302 0.98 ACE2 (0.55) OPRM1SPHK1ACE2DNM1TP53
SCHEMBL3616883 0.92 OPRM1 (0.52) OPRM1SPHK1ACE2DNM1TP53
SCHEMBL23094018 0.91 OPRM1 (0.52) OPRM1SPHK1ACE2DNM1TP53
SCHEMBL6724392 0.90 OPRM1 (0.56) OPRM1SPHK1ACE2DNM1TP53
SCHEMBL20603555 0.89 OPRM1 (0.60) OPRM1SPHK1DNM1TP53LMNA
SCHEMBL20603566 0.89 OPRM1 (0.60) OPRM1SPHK1DNM1TP53LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250109249-A1 Polyimide Resin, Resin Composition Containing Said Polyimide Resin, and Cured Product Thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2025-04-03 US disclosed
WO-2025047132-A1 RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, AND ORGANIC EL DISPLAY DEVICE 東レ株式会社 2025-03-06 WO disclosed
WO-2023112849-A1 ISOCYANATE-MODIFIED POLYIMIDE RESIN, AND RESIN COMPOSITION CONTAINING SAID ISOCYANATE-MODIFIED POLYIMIDE RESIN AND CURED PRODUCT OF SAME 日本化薬株式会社 2023-06-22 WO disclosed
WO-2023090348-A1 POLYIMIDE RESIN, RESIN COMPOSITION CONTAINING SAID POLYIMIDE RESIN, AND CURED PRODUCT THEREOF 日本化薬株式会社 2023-05-25 WO disclosed