SCHEMBL3616883

SCHEMBL3616883

CCCCC(C)CCCCC(N)N

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 1/20 0.52
LMNA P02545 2/20 0.43
ACE2 Q9BYF1 1/20 0.43
SPHK1 Q9NYA1 2/20 0.43
DNM1 Q05193 2/20 0.42
TP53 P04637 2/20 0.41
ALDH1A1 P00352 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
LAP3 P28838 2/20 0.37
SLC15A1 P46059 1/20 0.36
CYP2D6 P10635 2/20 0.35
PLA2G1B P04054 1/20 0.35
PLA2G2A P14555 1/20 0.35
GMNN O75496 1/20 0.35
POLB P06746 1/20 0.35
THPO P40225 1/20 0.35
MTOR P42345 1/20 0.35
BLM P54132 1/20 0.35
KDM4E B2RXH2 1/20 0.35
CYP1A2 P05177 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2049612 0.95 OPRM1 (0.46) OPRM1LMNAACE2SPHK1DNM1
SCHEMBL25265019 0.92 OPRM1 (0.56) OPRM1LMNAACE2SPHK1DNM1
SCHEMBL29461275 0.92 OPRM1 (0.56) OPRM1LMNAACE2SPHK1DNM1
SCHEMBL25264605 0.92 OPRM1 (0.56) OPRM1LMNAACE2SPHK1DNM1
SCHEMBL25181285 0.92 OPRM1 (0.56) OPRM1LMNAACE2SPHK1DNM1
SCHEMBL25187043 0.92 OPRM1 (0.56) OPRM1LMNAACE2SPHK1DNM1
SCHEMBL29461302 0.90 ACE2 (0.55) OPRM1LMNAACE2SPHK1DNM1
SCHEMBL14720632 0.90 OPRM1 (0.46) OPRM1LMNAACE2SPHK1TP53
SCHEMBL9637084 0.90 OPRM1 (0.46) OPRM1LMNAACE2SPHK1DNM1
SCHEMBL6724392 0.87 OPRM1 (0.56) OPRM1LMNAACE2SPHK1DNM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112266612-B Resin composition, and preparation method and application thereof 苏州生益科技有限公司 2022-11-25 CN claimed
CN-112266612-A Resin composition, and preparation method and application thereof 苏州生益科技有限公司 2021-01-26 CN claimed
CN-112266612-B Resin composition, and preparation method and application thereof 苏州生益科技有限公司 2022-11-25 CN disclosed
CN-112266612-A Resin composition, and preparation method and application thereof 苏州生益科技有限公司 2021-01-26 CN disclosed
EP-2020282-B1 MOLDINGS OF FIBER-REINFORCED THERMOPLASTIC RESIN MITSUBISHI ENG PLASTICS CORP (JP) 2014-08-13 EP disclosed
US-7858172-B2 Fiber-reinforced thermoplastic resin molded article MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2010-12-28 US disclosed
US-20100009158-A1 FIBER-REINFORCED THERMOPLASTIC RESIN MOLDED ARTICLE MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2010-01-14 US disclosed
EP-2020282-A1 MOLDINGS OF FIBER-REINFORCED THERMOPLASTIC RESIN Mitsubishi Engineering-Plastics Corporation (JP) 2009-02-04 EP disclosed