SCHEMBL25307196

SCHEMBL25307196

CC1(C)CCCCC1(CC1CCCCC1)C(=O)O

nearest known ligand 0.35

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
SLC1A3 P43003 3/20 0.35
SLC1A2 P43004 3/20 0.35
SLC1A1 P43005 3/20 0.35
LMNA P02545 2/20 0.33
POLB P06746 1/20 0.33
CYP2C19 P33261 2/20 0.32
KDM4E B2RXH2 1/20 0.32
GRM2 Q14416 1/20 0.31
CYP2D6 P10635 1/20 0.31
CTSL P07711 1/20 0.31
CTSB P07858 1/20 0.31
FFAR3 O14843 1/20 0.30
EPHX1 P07099 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15555 0.74 SLC1A3 (0.32) SLC1A3SLC1A2SLC1A1
SCHEMBL435252 0.74 MAPK1 (0.36) SLC1A3SLC1A2SLC1A1LMNACYP2C19
SCHEMBL6226499 0.72 SLC1A3 (0.33) SLC1A3SLC1A2SLC1A1
SCHEMBL4652908 0.72 KDM4E (0.33) SLC1A3SLC1A2SLC1A1LMNAPOLB
SCHEMBL467512 0.72 SLC1A3 (0.31) SLC1A3SLC1A2SLC1A1
SCHEMBL11346600 0.72 CYP2C19 (0.52) SLC1A3SLC1A2SLC1A1LMNACYP2C19
SCHEMBL6586703 0.72 CYP2C19 (0.52) SLC1A3SLC1A2SLC1A1LMNACYP2C19
SCHEMBL16116731 0.70 FFAR3 (0.37) CYP2C19FFAR3
SCHEMBL28766771 0.69
SCHEMBL7421923 0.67 CYP2C19 (0.40) SLC1A3SLC1A2SLC1A1LMNACYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023136299-A1 METHOD FOR LOWERING BONDING STRENGTH OF ADHESIVE LAYER 学校法人早稲田大学 2023-07-20 WO disclosed
WO-2023068109-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE 株式会社ADEKA 2023-04-27 WO disclosed
CN-104955915-B Antistatic additive, antistatic agent composition, antistatic resin compositions and formed body 株式会社ADEKA 2017-06-13 CN disclosed
CN-104262926-B Polycarbonate resin composition, and molded article, film, plate, and injection molded article obtained using same 三菱化学株式会社 2017-04-12 CN disclosed