SCHEMBL4652908

SCHEMBL4652908

CC1(C)C2OC2CCC1(CC1CCCCC1)C(=O)O

nearest known ligand 0.33

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.33
LMNA P02545 2/20 0.31
POLB P06746 1/20 0.31
MAPK1 P28482 2/20 0.31
TP53 P04637 1/20 0.31
NFKB1 P19838 1/20 0.31
CYP2C19 P33261 1/20 0.31
THPO P40225 1/20 0.31
STAT6 P42226 1/20 0.31
HIF1A Q16665 1/20 0.31
NPC1 O15118 1/20 0.31
GMNN O75496 1/20 0.31
MTOR P42345 1/20 0.31
RAB9A P51151 1/20 0.31
BLM P54132 1/20 0.31
PMP22 Q01453 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31
SLC1A3 P43003 2/20 0.31
SLC1A2 P43004 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28829553 0.77 MAPK1 (0.38) KDM4ELMNAMAPK1TP53NFKB1
SCHEMBL25402102 0.77 MAPK1 (0.31) KDM4ELMNAMAPK1TP53NFKB1
SCHEMBL4277476 0.77 LMNA (0.37) KDM4ELMNAPOLBMAPK1TP53
SCHEMBL4600800 0.75 MAPK1 (0.32) LMNAMAPK1TP53NFKB1CYP2C19
SCHEMBL435252 0.74 MAPK1 (0.36) LMNAMAPK1TP53NFKB1CYP2C19
SCHEMBL25307196 0.72 SLC1A3 (0.35) KDM4ELMNAPOLBCYP2C19SLC1A3
SCHEMBL28341384 0.72 CYP2D6 (0.32)
SCHEMBL7099542 0.71
SCHEMBL467512 0.71 SLC1A3 (0.31) SLC1A3SLC1A2SLC1A1
SCHEMBL28766771 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118541225-A Method for reducing bonding strength of bonding layer 学校法人早稻田大学 2024-08-23 CN disclosed
CN-116601236-A Curing agent composition for epoxy resin, epoxy resin composition, and paint 株式会社ADEKA 2023-08-15 CN disclosed
CN-115362229-A Pressure-sensitive adhesive composition, method for producing same, and removable sheet having pressure-sensitive adhesive layer 株式会社ADEKA 2022-11-18 CN disclosed
WO-2017096343-A1 PRIMER FOR PRESSURE SENSITIVE ADHESIVE LORD CORPORATION (US) 2017-06-08 WO disclosed
EP-1989271-A1 ONE-PART TYPE HEAT CURABLE COMPOSITION Sika Technology AG (CH) 2008-11-12 EP disclosed
WO-2007090875-A1 ONE-PART TYPE HEAT CURABLE COMPOSITION SIKA TECHNOLOGY AG (CH) 2007-08-16 WO disclosed
EP-0388037-A2 Low density self-extinguishing epoxide composition MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-09-19 EP disclosed