SCHEMBL2532013

SCHEMBL2532013

CC(C)CC(=O)CCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2527134 0.84 ALDH1A1 (0.42)
Ethylene Glycol SCHEMBL27955270 0.82 CYP2C19 (0.52)
SCHEMBL2532461 0.82 GPR84 (0.42)
SCHEMBL14860212 0.81
SCHEMBL2533535 0.80 GPR84 (0.46)
SCHEMBL2527255 0.80 GPR84 (0.46)
SCHEMBL13879345 0.80 ALDH1A1 (0.48)
SCHEMBL36990 0.78 CYP2C19 (0.59)
SCHEMBL10834211 0.78 CYP2C19 (0.59)
SCHEMBL104701 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106179142-B A kind of preparation method of photothermal response type essence capsule 上海应用技术学院 2019-06-28 CN claimed
US-8461135-B2 Boron-containing small molecules as anti-inflammatory agents ANACOR PHARMACEUTICALS, INC. (US) 2013-06-11 US claimed
US-8039450-B2 Boron-containing small molecules as anti-inflammatory agents ANACOR PHARMACEUTICALS, INC. (US) 2011-10-18 US claimed
CN-114660896-B Composition for forming silicon-containing resist underlayer film, pattern forming method, and silicon compound 信越化学工业株式会社 2024-06-11 CN disclosed
US-12001138-B2 Composition for forming silicon-containing resist underlayer film and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-04 US disclosed
US-11934100-B2 Composition for forming silicon-containing resist underlayer film and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-03-19 US disclosed
EP-3680275-B1 THERMOSETTING SILICON-CONTAINING COMPOUND, COMPOSITION FOR FORMING A SILICON-CONTAINING FILM, AND PATTERNING PROCESS SHINETSU CHEMICAL CO (JP) 2024-03-06 EP disclosed
EP-3796086-B1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS SHINETSU CHEMICAL CO (JP) 2024-02-28 EP disclosed
US-11914295-B2 Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-02-27 US disclosed
US-20230333472-A1 THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-19 US disclosed
US-20230305405-A1 COMPOSITION FOR FORMING SILICON-CONTAINING METAL HARD MASK AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-28 US disclosed
US-9994881-B2 Functionalized carboxylic acids and alcohols by reverse fatty acid oxidation in engineered microbes WILLIAM MARSH RICE UNIVERSITY (US) 2018-06-12 US disclosed
EP-2753689-B1 FUNCTIONALIZED CARBOXYLIC ACIDS AND ALCOHOLS BY REVERSE FATTY ACID OXIDATION UNIV RICE WILLIAM M (US) 2018-02-14 EP disclosed
US-8992790-B2 Patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-03-31 US disclosed
US-20140273110-A1 FUNCTIONALIZED CARBOXYLIC ACIDS AND ALCOHOLS BY REVERSE FATTY ACID OXIDATION WILLIAM MARSH RICE UNIVERSITY (US) 2014-09-18 US disclosed
US-20130284699-A1 PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-10-31 US disclosed
EP-2657767-A1 Patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2013-10-30 EP disclosed
EP-2209381-A1 DIFFERENTIAL EVAPORATION POTENTIATED DISINFECTANT SYSTEM XY, LLC (US) 2010-07-28 EP disclosed
WO-2009038672-A1 DIFFERENTIAL EVAPORATION POTENTIATED DISINFECTANT SYSTEM XY, INC. (US) 2009-03-26 WO disclosed
US-4443448-A ANALGESICS, ANTIDEPRESSANTS, NEUROLEPTICS KEFALAS A/S (DK) 1984-04-17 US disclosed