SCHEMBL25354233

SCHEMBL25354233

CCCN(NCc1ccccc1)N(CC)Cc1ccccc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.40
CA12 O43570 1/20 0.37
CA9 Q16790 1/20 0.37
ALDH1A1 P00352 3/20 0.37
RORC P51449 3/20 0.37
CNR2 P34972 1/20 0.37
LMNA P02545 1/20 0.37
KDM4E B2RXH2 1/20 0.36
CYP3A4 P08684 1/20 0.36
MAPT P10636 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
AOC3 Q16853 2/20 0.35
CARM1 Q86X55 1/20 0.35
PRMT6 Q96LA8 1/20 0.35
PRMT8 Q9NR22 1/20 0.35
CHRM2 P08172 1/20 0.35
HTR1A P08908 1/20 0.35
ADRA2A P08913 1/20 0.35
CHRM1 P11229 1/20 0.35
DRD1 P21728 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28094151 0.82 KCNH2 (0.42) KDM4ECYP3A4MAPTCHRM2HTR1A
SCHEMBL11214749 0.74 TSHR (0.58) TSHRALDH1A1CNR2LMNAKDM4E
SCHEMBL10530227 0.74 CYP3A4 (0.42) TSHRCA12CA9KDM4ECYP3A4
SCHEMBL26093384 0.73 CYP3A4 (0.45) CA12CA9KDM4ECYP3A4MAPT
SCHEMBL28147886 0.72 MEN1 (0.52) TSHRALDH1A1MAPTCHRM2
SCHEMBL17178604 0.72 TSHR (0.47) TSHRALDH1A1CNR2LMNAKDM4E
SCHEMBL8854666 0.70 CYP3A4 (0.50) TSHRALDH1A1KDM4ECYP3A4MAPT
Fluoride SCHEMBL8376221 0.70 TSHR (0.54) TSHRALDH1A1CNR2LMNAKDM4E
SCHEMBL1443950 0.70 TSHR (0.52) TSHRCA12CA9ALDH1A1LMNA
SCHEMBL10938979 0.69 SIGMAR1 (0.42) TSHRCA12CA9ALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250109324-A1 CURING AGENT FOR EPOXY RESIN, AND ADHESIVE SUNSTAR ENGINEERING INC. (JP) 2025-04-03 US disclosed
US-20240141095-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE ADEKA CORPORATION (JP) 2024-05-02 US disclosed
CN-117043221-A Curable composition, cured product, fiber-reinforced composite material, and fiber-reinforced resin molded article DIC株式会社 2023-11-10 CN disclosed
WO-2023153196-A1 CURING AGENT FOR EPOXY RESIN, AND ADHESIVE サンスター技研株式会社 2023-08-17 WO disclosed
WO-2022239471-A1 CURABLE COMPOSITION, CURED OBJECT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED FIBER-REINFORCED RESIN ARTICLE DIC株式会社 2022-11-17 WO disclosed
WO-2022168666-A1 CURABLE RESIN COMPOSITION 株式会社ADEKA 2022-08-11 WO disclosed
WO-2022168665-A1 NOVEL COMPOUND, AND CURABLE RESIN COMPOSITION CONTAINING SAID COMPOUND 株式会社ADEKA 2022-08-11 WO disclosed
WO-2022168670-A1 CHARGE TRANSFER COMPLEX 株式会社ADEKA 2022-08-11 WO disclosed