SCHEMBL25564341

SCHEMBL25564341

Cc1cc(I)cc(C(=O)OC2C3CC4C2OC(=O)C4C3C(=O)OCCC(F)C(F)(F)S(=O)(=O)O)c1I

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24268515 0.93 — —
SCHEMBL25564352 0.87 — —
SCHEMBL24268517 0.86 PTPN2 (0.30) —
SCHEMBL18232582 0.83 — —
SCHEMBL23351279 0.82 KCNH2 (0.33) —
SCHEMBL24268479 0.81 — —
SCHEMBL26233735 0.80 — —
SCHEMBL26059447 0.80 — —
SCHEMBL24268499 0.79 — —
SCHEMBL23351106 0.78 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230161254-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-25 — — US disclosed
US-20230161254-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-25 — — US disclosed
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