SCHEMBL25564352

SCHEMBL25564352

Cc1cc(I)cc(C(=O)OC2C3CC4C2OC(=O)C4C3C(=O)OCCC(F)(F)C(F)(F)S(=O)(=O)O)c1I

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24268499 0.92 — —
SCHEMBL25564341 0.87 — —
SCHEMBL24268501 0.85 PTPN2 (0.31) —
SCHEMBL24268505 0.82 — —
SCHEMBL23351280 0.82 ALDH1A1 (0.34) —
SCHEMBL3434212 0.81 — —
SCHEMBL24268506 0.81 — —
SCHEMBL26488799 0.79 — —
SCHEMBL24268515 0.79 — —
SCHEMBL19756184 0.79 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230161254-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-25 — — US disclosed
US-20230161254-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-25 — — US disclosed
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