SCHEMBL2577166

SCHEMBL2577166

C=C(C)C(=O)OCCC[Si](OC)(OC)OC.C=C(C)C(=O)OCCC[Si](OCC)(OCC)OCC

nearest known ligand 0.50

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.50
THRB P10828 1/20 0.47
POLB P06746 1/20 0.37
APEX1 P27695 1/20 0.37
HTT P42858 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
ALDH1A1 P00352 3/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4440431 0.97 TSHR (0.51) TSHRTHRBPOLBAPEX1HTT
SCHEMBL3417371 0.95 TSHR (0.51) TSHRTHRBPOLBAPEX1HTT
SCHEMBL1643136 0.95 TSHR (0.51) TSHRTHRBPOLBAPEX1HTT
SCHEMBL8901734 0.94 TSHR (0.45) TSHRTHRBPOLBAPEX1HTT
SCHEMBL25235967 0.94 TSHR (0.56) TSHRTHRBPOLBAPEX1HTT
SCHEMBL37108 0.94 TSHR (0.56) TSHRTHRBPOLBAPEX1HTT
SCHEMBL8438300 0.93 TSHR (0.44) TSHRTHRBPOLBAPEX1HTT
SCHEMBL16667448 0.93 TSHR (0.59) TSHRTHRBPOLBAPEX1HTT
SCHEMBL27874553 0.93 TSHR (0.44) TSHRTHRBPOLBAPEX1HTT
SCHEMBL15675382 0.93 TSHR (0.44) TSHRTHRBPOLBAPEX1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0827994-A2 Use of grafted amorphous poly-alfa-olefins as moisture-curable raw material for adhesives and as adhesives HÜLS AKTIENGESELLSCHAFT (DE) 1998-03-11 EP claimed
CN-120058549-A Polymers having an upper critical dissolution temperature in aqueous solution 波音公司 2025-05-30 CN disclosed
CN-119192444-A Water-soluble polymer, preparation method thereof and application thereof in grinding composition 武汉鼎泽新材料技术有限公司 2024-12-27 CN disclosed
WO-2024132849-A1 PPS COMPOSITION, PROCESS FOR PREPARATION, PROCESS FOR PRODUCING AN ARTICLE, AND ARTICLE MADE OF THE COMPOSITION DSM IP ASSETS B.V. (NL) 2024-06-27 WO disclosed
EP-4211191-A1 FLAME RESISTANT BODY FILL COMPOSITION Illinois Tool Works, Inc. (US) 2023-07-19 EP disclosed
WO-2022055913-A1 FLAME RESISTANT BODY FILL COMPOSITION ILLINOIS TOOL WORKS INC. (US) 2022-03-17 WO disclosed
WO-2020082006-A1 LOW HALOGEN TWO COMPONENT TOUGHENED EPOXY ADHESIVE ILLINOIS TOOL WORKS INC. (US) 2020-04-23 WO disclosed
EP-3161072-A1 SHEET MOLDING COMPOSITION CONTAINING SURFACE MODIFIED GLASS FILLER Continental Structural Plastics, Inc. (US) 2017-05-03 EP disclosed
WO-2016004059-A1 SHEET MOLDING COMPOSITION CONTAINING SURFACE MODIFIED GLASS FILLER CONTINENTAL STRUCTURAL PLASTICS, INC. (US) 2016-01-07 WO disclosed
EP-2644675-B1 ADHESIVE COMPOSITION FOR TOUCH PANEL, ADHESIVE FILM, AND TOUCH PANEL LG HAUSYS LTD (KR) 2015-10-21 EP disclosed
US-20130236672-A1 ADHESIVE COMPOSITION FOR TOUCH PANEL, ADHESIVE FILM, AND TOUCH PANEL LG HAUSYS, LTD (JP) 2013-09-12 US disclosed
US-8241513-B2 Pattern formed body and method for manufacturing same DAI NIPPON PRINTING CO., LTD. (JP) 2012-08-14 US disclosed
US-8048218-B2 Coating, aqueous coating material and process for producing coating using the same, and coated article with coating MITSUBISHI RAYON CO., LTD. (JP) 2011-11-01 US disclosed
US-20100051579-A1 PATTERN FORMED BODY AND METHOD FOR MANUFACTURING SAME DAI NIPPON PRINTING CO., LTD. (JP) 2010-03-04 US disclosed
US-20040048950-A1 Ink-jet ink composition for color filter, production method for ink composition, and production method for color filter DAI NIPPON PRINTING CO., LTD. (JP) 2004-03-11 US disclosed
US-4233419-A ORGANOSILANE COMPOUND BLENDED WITH RESIN PRIOR TO TREATMENT WITH LOW TEMPERATURE PLASMA OF A GAS AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 1980-11-11 US disclosed