SCHEMBL25812462

SCHEMBL25812462

C#CO[SiH2]CCCNc1ccccc1

nearest known ligand 0.52

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.52
ALDH1A1 P00352 1/20 0.52
L3MBTL1 Q9Y468 1/20 0.38
KCNH3 Q9ULD8 6/20 0.34
HRH3 Q9Y5N1 1/20 0.34
CYP1A2 P05177 1/20 0.33
CYP3A4 P08684 1/20 0.33
CYP2C19 P33261 1/20 0.33
ACHE P22303 1/20 0.33
HDAC3 O15379 1/20 0.32
HDAC1 Q13547 1/20 0.32
HDAC2 Q92769 1/20 0.32
NCOR2 Q9Y618 1/20 0.32
MAOA P21397 1/20 0.32
MAOB P27338 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1185279 0.77 MAPT (0.57) MAPTALDH1A1L3MBTL1KCNH3HRH3
SCHEMBL16684623 0.77 ALDH1A1 (0.57) MAPTALDH1A1L3MBTL1KCNH3HRH3
SCHEMBL1603893 0.75 ALDH1A1 (0.53) MAPTALDH1A1L3MBTL1KCNH3HRH3
SCHEMBL3917120 0.73 MAPT (0.52) MAPTALDH1A1L3MBTL1KCNH3HRH3
SCHEMBL3909232 0.73 MAPT (0.52) MAPTALDH1A1L3MBTL1KCNH3HRH3
SCHEMBL2065279 0.71 ALDH1A1 (1.00) MAPTALDH1A1L3MBTL1KCNH3HRH3
SCHEMBL4970157 0.71 ALDH1A1 (0.89) MAPTALDH1A1L3MBTL1KCNH3HRH3
SCHEMBL29162935 0.71 MAPT (0.64) MAPTALDH1A1L3MBTL1KCNH3HRH3
SCHEMBL24221984 0.69 ALDH1A1 (0.61) MAPTALDH1A1L3MBTL1KCNH3CYP1A2
SCHEMBL11759173 0.69 ALDH1A1 (0.84) MAPTALDH1A1L3MBTL1KCNH3ACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230221639-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-07-13 US disclosed
US-11640112-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-05-02 US disclosed