SCHEMBL25822865

SCHEMBL25822865

Cc1ccc2cc(C(=O)C(C)C)c(=O)oc2c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 3/20 0.56
MAOB P27338 10/20 0.54
CA12 O43570 3/20 0.54
CA9 Q16790 3/20 0.54
CA1 P00915 1/20 0.54
CA2 P00918 1/20 0.54
CA4 P22748 1/20 0.54
CA6 P23280 1/20 0.54
CA5A P35218 1/20 0.54
CA7 P43166 1/20 0.54
CA14 Q9ULX7 1/20 0.54
CA5B Q9Y2D0 1/20 0.54
KDM4E B2RXH2 3/20 0.50
MIF P14174 2/20 0.50
GAA P10253 2/20 0.50
MEN1 O00255 1/20 0.50
S1PR4 O95977 1/20 0.50
GLA P06280 1/20 0.50
MAPT P10636 1/20 0.50
S1PR1 P21453 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25443679 0.85 MEN1 (0.70) HSD11B1MAOBCA1KDM4EMIF
SCHEMBL12611180 0.83 HSD11B1 (0.78) HSD11B1MAOBCA12CA9CA1
SCHEMBL10305750 0.83 CA12 (0.77) HSD11B1MAOBCA12CA9CA1
SCHEMBL6362277 0.81 HSD11B1 (0.58) HSD11B1MAOBCA12CA9CA1
SCHEMBL30657697 0.81 MAOB (0.69) MAOBCA12CA9CA1CA4
SCHEMBL52440 0.81 MAOB (0.69) MAOBCA12CA9CA1CA4
SCHEMBL30782203 0.81 SLC16A3 (0.72) MAOBCA12CA9KDM4EMIF
SCHEMBL20414710 0.81 ALDH1A1 (0.72) HSD11B1MAOBCA12CA9CA1
SCHEMBL51307 0.81 SLC16A3 (0.72) MAOBCA12CA9KDM4EMIF
SCHEMBL20411327 0.79 HSD11B1 (0.56) HSD11B1MAOBCA12CA9CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230229084-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-20 US disclosed