SCHEMBL258806

SCHEMBL258806

CCCNN(CCC)CCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1793939 1.00
SCHEMBL2885689 0.92 TSHR (0.33)
SCHEMBL2886817 0.88
SCHEMBL21674317 0.87 PRMT3 (0.35)
SCHEMBL14130788 0.87 CYP2C9 (0.30)
SCHEMBL28562123 0.85
SCHEMBL181643 0.85 TSHR (0.36)
SCHEMBL28517069 0.84
SCHEMBL2361409 0.82 DNM1 (0.43)
SCHEMBL578855 0.82 TSHR (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 481 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12630669-B2 Waterborne epoxy curing agent EVONIK OPERATIONS GMBH (DE) 2026-05-19 US claimed
US-20250066535-A1 WATERBORNE EPOXY CURING AGENT EVONIK OPERATIONS GMBH (DE) 2025-02-27 US claimed
CN-115109230-A Aqueous epoxy curing agent 赢创运营有限公司 2022-09-27 CN claimed
US-20220298296-A1 WATERBORNE EPOXY CURING AGENT EVONIK OPERATIONS GMBH (DE) 2022-09-22 US claimed
US-8063161-B2 Low temperature curing acrylate and maleimide based formulations and methods for use thereof DESIGNER MOLECULES, INC. (US) 2011-11-22 US claimed
US-20100063184-A1 LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF DESIGNER MOLECULES, INC. (US) 2010-03-11 US claimed
WO-2008130894-A1 LOW TEMPERATURE CURING ACRYLATE AND MALEIMIDE BASED FORMULATIONS AND METHODS FOR USE THEREOF DESIGNER MOLECULES, INC. (US) 2008-10-30 WO claimed
EP-0748855-B1 Heatset intaglio printing ink SUN CHEMICAL CORP (US) 1999-07-07 EP claimed
EP-4748869-A1 EPOXY RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT Namics Corporation (JP) 2026-05-27 EP disclosed
EP-4748870-A1 EPOXY RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT Namics Corporation (JP) 2026-05-27 EP disclosed
US-20260139157-A1 THERMAL-AND-UV-CURABLE (METH)ACRYLATE COMPOSITION HENKEL AG & CO KGAA (DE) 2026-05-21 US disclosed
US-12630669-B2 Waterborne epoxy curing agent EVONIK OPERATIONS GMBH (DE) 2026-05-19 US disclosed
WO-2026100231-A1 CURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT ナミックス株式会社 2026-05-15 WO disclosed
EP-4692055-A1 THIOL COMPOUND AJINOMOTO CO., INC. (JP) 2026-02-11 EP disclosed
US-4169859-A POLYMERIC KETONE FROM ALPHA-OLEFIN AND ACYL HALIDE CATALYST, ASHLESS DETERGENTS ATLANTIC RICHFIELD COMPANY (US) 1979-10-02 US disclosed
US-4157339-A Phosphonamidic condensation reaction product ATLANTIC RICHFIELD COMPANY (US) 1979-06-05 US disclosed
US-4119552-A DISPERSANT, AMIDATION OF PHENOXYALKANOIC ACID, REACTION OF THE AMIDE WITH A BORON COMPOUND EDWIN COOPER AND COMPANY LIMITED (GB) 1978-10-10 US disclosed
US-4028414-A LUBE OIL DETERGENT ATLANTIC RICHFIELD COMPANY (US) 1977-06-07 US disclosed
US-3962113-A METHOD FOR ACCELERATING OXYGEN REMOVAL EMPLOYING AN AQUEOUS SOLUTION OF AN ALKYL HYDRAZINE OLIN CORPORATION (US) 1976-06-08 US disclosed
US-3941808-A POLYAMIDE AMINE SALTS OF A STYRENE-MALEIC ANHYDRIDE COPOLYMER ATLANTIC RICHFIELD COMPANY (US) 1976-03-02 US disclosed