SCHEMBL258860

SCHEMBL258860

CC1(C)CCCC(C)(C(N)N)C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23482543 0.81
SCHEMBL5167880 0.79 ALDH1A1 (0.39)
Sebacic Acid SCHEMBL5171609 0.79 ALDH1A1 (0.39)
SCHEMBL5708101 0.75
SCHEMBL13764905 0.73
SCHEMBL12333584 0.73
SCHEMBL22227719 0.73 DPP4 (0.33)
SCHEMBL9064747 0.71
SCHEMBL286847 0.71
Hydrochloric Acid SCHEMBL3788037 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7267915-B2 Photoconductive element having an amorphous polymeric barrier layer EASTMAN KODAK COMPANY (US) 2007-09-11 US claimed
EP-1774408-A1 PHOTOCONDUCTIVE ELEMENT HAVING AMORPHOUS, POLYMERIC BARRIER LAYER EASTMAN KODAK COMPANY (US) 2007-04-18 EP claimed
WO-2006017012-A1 PHOTOCONDUCTIVE ELEMENT HAVING AMORPHOUS, POLYMERIC BARRIER LAYER EASTMAN KODAK COMPANY (US) 2006-02-16 WO claimed
US-20060008720-A1 Photoconductive element having an amorphous polymeric barrier layer EASTMAN KODAK COMPANY 2006-01-12 US claimed
CN-106164132-B polyimide composition 富士胶片电子材料美国有限公司 2019-08-23 CN disclosed
EP-3394136-A1 POLYALDIMINE AND CURABLE POLYURETHANE COMPOSITION Sika Technology AG (CH) 2018-10-31 EP disclosed
CN-106164132-A Novel polyimide compositions 富士胶片电子材料美国有限公司 2016-11-23 CN disclosed
EP-2572876-B1 Alumnium alloy-resin composite and method for producing the same TAISEI PLAS CO LTD (JP) 2014-03-26 EP disclosed
EP-1958763-B1 ALUMINUM ALLOY-POLYAMIDE RESIN COMPOSITE AND METHOD OF PRODUCING THE SAME TAISEI PLAS CO LTD (JP) 2013-11-06 EP disclosed
EP-2572876-A1 Alumnium alloy-resin composite and method for producing the same TAISEI PLAS CO., LTD. (JP) 2013-03-27 EP disclosed
US-8057890-B2 Composite of aluminum alloy and resin and manufacturing method thereof TAISEI PLAS CO., LTD. (JP) 2011-11-15 US disclosed
US-20090274889-A1 COMPOSITE OF ALUMINUM ALLOY AND RESIN AND MANUFACTURING METHOD THEREOF TAISEI PLAS CO., LTD. (JP) 2009-11-05 US disclosed
US-20030162109-A1 Photoconductive elements having a polymeric barrier layer EASTMAN KODAK COMPANY 2003-08-28 US disclosed
US-6593046-B2 Barriers; stable electroconductivity; waterproof HEIDELBERGER DRUCKMASCHINEN AG (DE) 2003-07-15 US disclosed
EP-1293838-A1 Photoconductive elements having a polymeric barrier layer Heidelberger Druckmaschinen Aktiengesellschaft (DE) 2003-03-19 EP disclosed
US-20020155365-A1 Photoconductive elements having a polymeric barrier layer FAR EAST DEVELOPMENT LTD. 2002-10-24 US disclosed
US-6451956-B2 MULTILAYER; POLYMERIC BARRIER NEX PRESS SOLUTIONS LLC 2002-09-17 US disclosed
US-20020012862-A1 Novel polymer and photoconductive element having a polymeric barrier layer NEXPRESS SOLUTIONS, LLC 2002-01-31 US disclosed
EP-1156372-A1 Novel polymer and photoconductive element having a polymeric barrier layer NexPress Solutions LLC (US) 2001-11-21 EP disclosed
US-6294301-B1 BARRIER LAYER COMPRISES A POLYESTER-CO-IMIDE, POLYESTERIONOMER-CO-IMIDE OR POLYAMIDE-CO-IMIDE NEXPRESS SOLUTIONS LLC 2001-09-25 US disclosed