SCHEMBL25899292

SCHEMBL25899292

O=C1c2ccc(Oc3ccc(Cc4ccc(Oc5ccc6c(c5)C(=O)N(c5ccccc5)C6=O)cc4)cc3)cc2C(=O)N1c1ccccc1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BRD4 O60885 1/20 0.57
MEN1 O00255 4/20 0.54
KMT2A Q03164 4/20 0.54
POLB P06746 2/20 0.54
MAPK1 P28482 1/20 0.54
ESR1 P03372 1/20 0.51
HTT P42858 1/20 0.50
NR1H3 Q13133 1/20 0.49
ALDH1A1 P00352 2/20 0.48
NPSR1 Q6W5P4 2/20 0.48
MAPT P10636 1/20 0.48
STAT3 P40763 1/20 0.48
GRM5 P41594 1/20 0.48
TDP1 Q9NUW8 1/20 0.48
PTGES O14684 1/20 0.47
LPAR1 Q92633 1/20 0.47
LPAR5 Q9H1C0 1/20 0.47
LPAR3 Q9UBY5 1/20 0.47
PPARD Q03181 1/20 0.47
PPARA Q07869 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL261725 0.89 BRD4 (0.68) BRD4MEN1KMT2APOLBMAPK1
SCHEMBL22310425 0.87 BRD4 (0.61) BRD4MEN1KMT2APOLBMAPK1
SCHEMBL17272758 0.86 BRD4 (0.73) BRD4MEN1KMT2APOLBMAPK1
SCHEMBL25899308 0.85 MEN1 (0.64) BRD4MEN1KMT2APOLBMAPK1
SCHEMBL13678848 0.85 MEN1 (0.69) BRD4MEN1KMT2APOLBMAPK1
SCHEMBL15347082 0.84 BRD4 (0.58) BRD4MEN1KMT2APOLBMAPK1
SCHEMBL10641093 0.84 BRD4 (0.65) BRD4MEN1KMT2APOLBMAPK1
SCHEMBL25899286 0.83 ESR1 (0.62) POLBESR1NR1H3ALDH1A1NPSR1
SCHEMBL20346175 0.82 BRD4 (0.63) BRD4MEN1KMT2APOLBMAPK1
SCHEMBL19689370 0.82 BRD4 (0.72) BRD4MEN1KMT2APOLBMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230236508-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT RESONAC CORPORATION (JP) 2023-07-27 US disclosed