SCHEMBL25960261

SCHEMBL25960261

CCN(C[SiH3])C(=O)OC(C)(C)C

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA14 Q9ULX7 2/20 0.39
HDAC6 Q9UBN7 2/20 0.36
HDAC1 Q13547 2/20 0.36
HDAC2 Q92769 2/20 0.36
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
HDAC3 O15379 1/20 0.33
NCOR2 Q9Y618 1/20 0.33
NFKB1 P19838 1/20 0.33
NFKB2 Q00653 1/20 0.33
RELA Q04206 1/20 0.33
CA12 O43570 1/20 0.33
CA1 P00915 1/20 0.33
CA7 P43166 1/20 0.33
LMNA P02545 2/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
CTSK P43235 1/20 0.32
SSTR4 P31391 1/20 0.31
MMP1 P03956 1/20 0.31
MMP2 P08253 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1962792 0.87 MEN1 (0.45) CA14HDAC6HDAC1HDAC2MEN1
SCHEMBL25960258 0.84 CA12 (0.41) CA14HDAC6HDAC1HDAC2HDAC3
SCHEMBL25960297 0.84 MEN1 (0.33) CA14MEN1KMT2ALMNA
SCHEMBL25960259 0.81 CA14 (0.45) CA14HDAC6HDAC1HDAC2HDAC3
SCHEMBL25960249 0.81 CA14 (0.45) CA14HDAC6HDAC1HDAC2MEN1
SCHEMBL15725091 0.81 CA14 (0.40) CA14HDAC6HDAC1HDAC2MEN1
SCHEMBL19302428 0.79 CA14 (0.39) CA14HDAC6HDAC1HDAC2MEN1
SCHEMBL20989891 0.79 CA14 (0.39) CA14HDAC6HDAC1HDAC2MEN1
SCHEMBL21012200 0.79 CA14 (0.39) CA14HDAC6HDAC1HDAC2MEN1
SCHEMBL10267170 0.79 CA12 (0.43) CA14HDAC6HDAC1HDAC2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230244149-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-08-03 US disclosed