SCHEMBL259855

SCHEMBL259855

CCSNC(N)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bromide SCHEMBL9983514 0.97
Chloroacetic Acid SCHEMBL27973820 0.87 TSHR (0.42)
SCHEMBL3078358 0.80 CRBN (0.39)
SCHEMBL1099068 0.79
SCHEMBL3081728 0.79
SCHEMBL3415463 0.78 MCL1 (0.36)
Carbamic Acid SCHEMBL28286230 0.77 ALOX15 (0.33)
Carbamic Acid SCHEMBL28986818 0.77 ALOX15 (0.33)
Water SCHEMBL27857925 0.77
SCHEMBL4631863 0.77 ALDH1A1 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 505 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3884921-B1 DENTAL POLYMERIZABLE COMPOSITION G C DENTAL IND CORP (JP) 2025-07-02 EP claimed
EP-3884922-B1 DENTAL POLYMERIZABLE COMPOSITION G C DENTAL IND CORP (JP) 2025-06-18 EP claimed
WO-2025086728-A1 COPPER PLATING SOLUTION, METALLIC COPPER LAYER COMPRISING SAME AND USE OF COPPER PLATING SOLUTION 江阴纳力新材料科技有限公司 2025-05-01 WO claimed
CN-119900058-A Copper plating solution, metal copper layer comprising copper plating solution and application of copper plating solution 江阴纳力新材料科技有限公司 2025-04-29 CN claimed
WO-2025073376-A1 MASKING PREPARATIONS AND COMPOUNDS FROM DAEMONOROPS DRACO (DRAGON BLOOD) SYMRISE AG (DE) 2025-04-10 WO claimed
CN-119243226-A Two-dimensional molybdenum-based nano-sheet catalyst and preparation method and application thereof 重庆理工大学 2025-01-03 CN claimed
CN-118401072-A Stannous sulfide-tin-based perovskite heterojunction thin film transistor and preparation method thereof 复旦大学 2024-07-26 CN claimed
CN-118272876-A Method for manufacturing electrolytic copper foil with high tensile strength after heat treatment 陕西未来尖端材料科技有限公司 2024-07-02 CN claimed
CN-118241268-A High tensile strength electrolytic copper foil additive, electrolytic copper foil and preparation method 陕西未来尖端材料科技有限公司 2024-06-25 CN claimed
CN-116731654-A Low-temperature quick-curing epoxy adhesive and preparation method thereof 成都拓利科技股份有限公司 2023-09-12 CN claimed
WO-2006053033-A2 INK JET INK COMPOSITIONS FOR ENDORSING APPLICATIONS NU-KOTE INTERNATIONAL, INC. (US) 2006-05-18 WO claimed
WO-2005105765-A1 NITRIC OXIDE DONORS AND USES THEREOF RENOPHARM LTD. (IL) 2005-11-10 WO claimed
EP-1543122-A2 BITTER TASTE RECEPTORS Deutsches Institut für Ernährungsforschung (DE) 2005-06-22 EP claimed
WO-2004029087-A2 BITTER TASTE RECEPTORS Deutsches Institut für Ernährungsforschung (DE) 2004-04-08 WO claimed
EP-0897998-B1 Reductive nickel bath AMI DODUCO GMBH (DE) 2001-12-05 EP claimed
EP-0598763-B1 ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH ATOTECH DEUTSCHLAND GMBH (DE) 1995-12-13 EP claimed
US-5433840-A Polyoxyalkylene glycol ethers, copper salts and acid ATOTECH DEUTSCHLAND GMBH (DE) 1995-07-18 US claimed
EP-0554275-B1 ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE ATOTECH DEUTSCHLAND GMBH (DE) 1994-12-14 EP claimed
US-4177072-A HYDROPHILIC AND OLEOPHILIC AREAS FUJI PHOTO FILM CO., LTD. (JP) 1979-12-04 US claimed
US-4083899-A Accelerated process of alcoholysis or phenolysis of phosporus pentasulfide PRODUITS CHIMIQUES UGINE KUHLMANN (FR) 1978-04-11 US claimed