SCHEMBL2600709

SCHEMBL2600709

C=C[Si](C=C)(C=C)O[Si](C)(C)O[Si](O[Si](C=C)(C=C)C=C)(c1ccccc1)c1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31081419 0.96
SCHEMBL3481638 0.89 ALDH1A1 (0.33)
SCHEMBL2600700 0.82
SCHEMBL2600710 0.82
SCHEMBL3481648 0.81
SCHEMBL15431276 0.81
SCHEMBL2600705 0.81
SCHEMBL12032191 0.81
SCHEMBL19499568 0.79
SCHEMBL16749899 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10040924-B2 Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-08-07 US disclosed
US-9695301-B2 Nanoparticle, method for producing nanoparticle, addition curing silicone resin composition, and semiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-07-04 US disclosed
US-20170121504-A1 ADHESION PROMOTER, ADDITION CURABLE ORGANOPOLYSILOXANE RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-04 US disclosed
US-20160355671-A1 NANOPARTICLE, METHOD FOR PRODUCING NANOPARTICLE, ADDITION CURING SILICONE RESIN COMPOSITION, AND SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-12-08 US disclosed
US-9403967-B2 Curable resin composition, cured product thereof and photosemiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-08-02 US disclosed
US-20160185912-A1 CURABLE SILICONE RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-06-30 US disclosed
US-9306133-B2 Optical semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-04-05 US disclosed
US-20140339473-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF AND PHOTOSEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-11-20 US disclosed
US-8791213-B2 Curable silicone resin composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-07-29 US disclosed
US-20140175488-A1 HEAT-CURABLE SILICONE RESIN SHEET HAVING PHOSPHOR-CONTAINING LAYER AND WHITE PIGMENT-CONTAINING LAYER, METHOD OF PRODUCING LIGHT EMITTING DEVICE USING SAME AND ENCAPSULATED LIGHT EMITTING SEMICONDUCTOR DEVICE PRODUCED THEREBY SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-06-26 US disclosed
US-20100213502-A1 OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATED WITH SILICONE RESIN SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-08-26 US disclosed
US-20100197870-A1 LENS-FORMING SILICONE RESIN COMPOSITION AND SILICONE LENS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-08-05 US disclosed
US-20090236759-A1 CURABLE SILICONE RUBBER COMPOSITION AND SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-09-24 US disclosed
US-7588967-B2 Curable silicone rubber composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-09-15 US disclosed
US-7566756-B2 a mixture of polysiloxanes and a platinum group catalyst, that cure to form products with excellent flexibility and minimal surface tack, suited for use as silicone lens SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-07-28 US disclosed
US-7521813-B2 Protective coating is cured unsaturated polysiloxane rubber SHIN-ESTU CHEMICAL CO., LTD. (JP) 2009-04-21 US disclosed
US-20080249259-A1 a mixture of polysiloxanes and a platinum group catalyst, that cure to form products with excellent flexibility and minimal surface tack, suited for use as silicone lens SHIN-ETSU CHEMICAL CO., LTD. 2008-10-09 US disclosed
US-20080015326-A1 CURABLE SILICONE RUBBER COMPOSITION AND CURED PRODUCT THEREOF SHIN -ETSU CHEMICAL CO., LTD. (JP) 2008-01-17 US disclosed
US-20070166470-A1 CURABLE SILICONE RUBBER COMPOSITION AND CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-07-19 US disclosed
US-20070077360-A1 Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device SHIN -ETSU CHEMICAL CO., LTD. (JP) 2007-04-05 US disclosed