SCHEMBL2600705

SCHEMBL2600705

C=C[Si](C=C)(O[Si](C)(C)O[Si](O[Si](C=C)(C=C)c1ccccc1)(c1ccccc1)c1ccccc1)c1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15830979 0.92
SCHEMBL3481365 0.89 ALDH1A1 (0.32)
SCHEMBL3481482 0.82
SCHEMBL31081419 0.81
SCHEMBL2600700 0.81
SCHEMBL2600710 0.81
SCHEMBL2600709 0.81
SCHEMBL12032191 0.79
SCHEMBL15431276 0.79
SCHEMBL94036 0.79 ALDH1A1 (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10040924-B2 Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-08-07 US disclosed
US-20170330813-A1 BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-11-16 US disclosed
US-20170282527-A1 VACUUM LAMINATING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-10-05 US disclosed
US-9695301-B2 Nanoparticle, method for producing nanoparticle, addition curing silicone resin composition, and semiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-07-04 US disclosed
US-20170121504-A1 ADHESION PROMOTER, ADDITION CURABLE ORGANOPOLYSILOXANE RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-04 US disclosed
US-20160355671-A1 NANOPARTICLE, METHOD FOR PRODUCING NANOPARTICLE, ADDITION CURING SILICONE RESIN COMPOSITION, AND SEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-12-08 US disclosed
US-9403967-B2 Curable resin composition, cured product thereof and photosemiconductor apparatus SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-08-02 US disclosed
US-20160185912-A1 CURABLE SILICONE RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-06-30 US disclosed
US-9306133-B2 Optical semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-04-05 US disclosed
US-20140339473-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF AND PHOTOSEMICONDUCTOR APPARATUS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-11-20 US disclosed
US-7829651-B2 Lens-forming silicone resin composition and silicone lens SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-11-09 US disclosed
US-20100213502-A1 OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATED WITH SILICONE RESIN SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-08-26 US disclosed
US-20100197870-A1 LENS-FORMING SILICONE RESIN COMPOSITION AND SILICONE LENS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-08-05 US disclosed
US-20090236759-A1 CURABLE SILICONE RUBBER COMPOSITION AND SEMICONDUCTOR DEVICE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-09-24 US disclosed
US-7588967-B2 Curable silicone rubber composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-09-15 US disclosed
US-7566756-B2 a mixture of polysiloxanes and a platinum group catalyst, that cure to form products with excellent flexibility and minimal surface tack, suited for use as silicone lens SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-07-28 US disclosed
US-7521813-B2 Protective coating is cured unsaturated polysiloxane rubber SHIN-ESTU CHEMICAL CO., LTD. (JP) 2009-04-21 US disclosed
US-20080249259-A1 a mixture of polysiloxanes and a platinum group catalyst, that cure to form products with excellent flexibility and minimal surface tack, suited for use as silicone lens SHIN-ETSU CHEMICAL CO., LTD. 2008-10-09 US disclosed
US-20070166470-A1 CURABLE SILICONE RUBBER COMPOSITION AND CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-07-19 US disclosed
US-20070077360-A1 Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device SHIN -ETSU CHEMICAL CO., LTD. (JP) 2007-04-05 US disclosed