SCHEMBL260075

SCHEMBL260075

CNC(=O)CC(C)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14890587 0.97 LMNA (0.42)
Acetoacetic Acid SCHEMBL29615277 0.89 KDM4E (0.42)
SCHEMBL7073061 0.87 LMNA (0.36)
SCHEMBL12328434 0.85 KDM4E (0.44)
SCHEMBL6655055 0.84 LMNA (0.34)
SCHEMBL2106440 0.82
SCHEMBL12660315 0.79
SCHEMBL31331896 0.78
SCHEMBL8335018 0.78
SCHEMBL1401066 0.76 MGAM (0.45)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 622 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12331239-B2 Composition and process for selectively etching a layer comprising an aluminium compound in the presence of layers of low-k materials, copper and/or cobalt BASF SE (DE) 2025-06-17 US claimed
CN-119314868-A Wafer cleaning liquid and semiconductor structure forming method 中芯国际集成电路制造(上海)有限公司 2025-01-14 CN claimed
CN-118393827-A High-temperature-resistant low-corrosion photoresist stripping liquid and preparation method and application thereof 浙江奥首材料科技有限公司 2024-07-26 CN claimed
CN-118016514-A Method for forming semiconductor device and cleaning liquid 中芯国际集成电路制造(上海)有限公司 2024-05-10 CN claimed
US-20240093089-A1 COMPOSITION AND PROCESS FOR SELECTIVELY ETCHING A LAYER COMPRISING AN ALUMINIUM COMPOUND IN THE PRESENCE OF LAYERS OF LOW-K MATERIALS, COPPER AND/OR COBALT BASF SE (DE) 2024-03-21 US claimed
WO-2023147330-A1 PREPARATION OF UNSATURATED POLYESTERS EASTMAN CHEMICAL COMPANY (US) 2023-08-03 WO claimed
CN-115981119-A Photoresist stripping liquid TCL华星光电技术有限公司 2023-04-18 CN claimed
EP-3962990-B1 MELAMINE FORMALDEHYDE FOAM WITH REDUCED FORMALDEHYDE EMISSION BASF SE (DE) 2023-03-22 EP claimed
US-20220325063-A1 MELAMINE FORMALDEHYDE FOAM WITH REDUCED FORMALDEHYDE EMISSION BASF SE (DE) 2022-10-13 US claimed
CN-113861051-B Polyurethane material and preparation, recovery and regeneration method thereof 上海交通大学 2022-09-02 CN claimed
WO-1998028395-A1 FORMULATIONS INCLUDING A 1,3-DICARBONYL COMPOUND CHELATING AGENT FOR STRIPPING RESIDUES FROM SEMICONDUCTOR SUBSTRATES ADVANCED CHEMICAL SYSTEMS INTERNATIONAL, INC. (US) 1998-07-02 WO claimed
EP-0697030-A1 CROSSLINKABLE COATING COMPOSITIONS ZENECA LIMITED (GB) 1996-02-21 EP claimed
WO-1994021738-A1 CROSSLINKABLE COATING COMPOSITIONS ZENECA LIMITED (GB) 1994-09-29 WO claimed
US-5160679-A Urea-formaldehyde adhesive HEXION INC. 1992-11-03 US claimed
US-5049698-A Chlorination EASTMAN KODAK COMPANY (US) 1991-09-17 US claimed
US-4992585-A Reacting N-methylacetoacetamide with chlorie to produce A-chloro-N-methyl acetoacetamide CIBA-GEIGY CORPORATION (US) 1991-02-12 US claimed
EP-0166685-B1 PROCESS FOR THE PREPARATION OF ALPHA-CHLOROACETOACETIC-ACID MONOMETHYL AMIDE CIBA-GEIGY AG (CH) 1988-12-28 EP claimed
CN-87102556-A Chlorination technology of permanently effective phosphorous improves and wastewater treatment 1988-10-12 CN claimed
US-4235818-A Process for producing alpha-monochloroacetoacetic acid monomethylamide CIBA-GEIGY CORPORATION (US) 1980-11-25 US claimed
US-3944428-A Alkaline curing corrugating adhesive NATIONAL STARCH AND CHEMICAL CORPORATION (US) 1976-03-16 US claimed