Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KCNMA1 | Q12791 | 5/20 | 0.71 |
| ▸ | MMP13 | P45452 | 1/20 | 0.55 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.55 |
| ▸ | P2RY14 | Q15391 | 2/20 | 0.53 |
| ▸ | NPC1 | O15118 | 5/20 | 0.52 |
| ▸ | RAB9A | P51151 | 3/20 | 0.52 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.52 |
| ▸ | LMNA | P02545 | 2/20 | 0.52 |
| ▸ | GAA | P10253 | 2/20 | 0.52 |
| ▸ | TP53 | P04637 | 1/20 | 0.52 |
| ▸ | AHR | P35869 | 1/20 | 0.52 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.52 |
| ▸ | MEN1 | O00255 | 2/20 | 0.52 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.49 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.49 |
| ▸ | MAPT | P10636 | 1/20 | 0.49 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.49 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9968283 | 0.94 | KCNMA1 (0.64) | KCNMA1MMP13HDAC1P2RY14NPC1 | |
| SCHEMBL19846843 | 0.91 | KCNMA1 (0.62) | KCNMA1MMP13HDAC1P2RY14NPC1 | |
| SCHEMBL6029542 | 0.91 | KCNMA1 (0.84) | KCNMA1HDAC1NPC1RAB9ASMN1; SMN2 | |
| SCHEMBL2605548 | 0.89 | KCNMA1 (0.82) | KCNMA1HDAC1NPC1RAB9ASMN1; SMN2 | |
| SCHEMBL14363236 | 0.86 | KCNMA1 (0.77) | KCNMA1HDAC1NPC1RAB9ASMN1; SMN2 | |
| SCHEMBL14363221 | 0.85 | KCNMA1 (0.67) | KCNMA1HDAC1NPC1RAB9ASMN1; SMN2 | |
| SCHEMBL21360970 | 0.84 | KCNMA1 (0.69) | KCNMA1NPC1RAB9ASMN1; SMN2GAA | |
| SCHEMBL5427738 | 0.84 | KDR (0.53) | KCNMA1MMP13HDAC1KMT2AMEN1 | |
| SCHEMBL14363234 | 0.83 | KCNMA1 (0.72) | KCNMA1HDAC1NPC1RAB9ASMN1; SMN2 | |
| SCHEMBL10873010 | 0.83 | KCNMA1 (1.00) | KCNMA1HDAC1NPC1RAB9ASMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10908500-B2 | Cured film and method for producing same | TORAY INDUSTRIES, INC. (JP) | 2021-02-02 | — | — | US | disclosed |
| US-10696845-B2 | Energy-sensitive resin composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-06-30 | — | — | US | disclosed |
| US-10545406-B2 | Cured film formed by curing photosensitive resin composition and method for manufacturing same | TORAY INDUSTRIES, INC. (JP) | 2020-01-28 | — | — | US | disclosed |
| US-20190225804-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-07-25 | — | — | US | disclosed |
| US-10197915-B2 | Resin and photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2019-02-05 | — | — | US | disclosed |
| US-20190004423-A1 | CURED FILM AND METHOD FOR PRODUCING SAME | TORAY INDUSTRIES, INC. (JP) | 2019-01-03 | — | — | US | disclosed |
| US-20180203353-A1 | CURED FILM AND METHOD FOR MANUFACTURING SAME | TORAY INDUSTRIES, INC. (JP) | 2018-07-19 | — | — | US | disclosed |
| US-20180203353-A1 | CURED FILM AND METHOD FOR MANUFACTURING SAME | TORAY INDUSTRIES, INC. (JP) | 2018-07-19 | — | — | US | disclosed |
| US-20180066107-A1 | PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2018-03-08 | — | — | US | disclosed |
| US-20180039174-A1 | PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2018-02-08 | — | — | US | disclosed |
| US-20100099041-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2010-04-22 | — | — | US | disclosed |
| EP-1475665-B1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES (JP) | 2009-12-30 | — | — | EP | disclosed |
| EP-2110708-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Toray Industries, Inc. (JP) | 2009-10-21 | — | — | EP | disclosed |
| US-7507518-B2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2009-03-24 | — | — | US | disclosed |
| US-7507518-B2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2009-03-24 | — | — | US | disclosed |
| US-20080193718-A1 | Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof | TORAY INDUSTRIES, INC. (JP) | 2008-08-14 | — | — | US | disclosed |
| US-20080193718-A1 | Positive Photosensitive Resin Compositions, and Relief Patterns and Solid-State Image Sensors Made Thereof | TORAY INDUSTRIES, INC. (JP) | 2008-08-14 | — | — | US | disclosed |
| EP-1132773-B1 | POSITIVE-TYPE PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION | TORAY INDUSTRIES (JP) | 2007-07-11 | — | — | EP | disclosed |
| US-7214455-B2 | Photosensitive resin composition and process for producing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2007-05-08 | — | — | US | disclosed |
| US-7214455-B2 | Photosensitive resin composition and process for producing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2007-05-08 | — | — | US | disclosed |