SCHEMBL9968283

SCHEMBL9968283

CC(=O)c1ccc(Oc2ccc(C(=O)Nc3cc(C)ccc3O)cc2)cc1

nearest known ligand 0.64

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ KCNMA1 Q12791 5/20 0.64
▸ RAB9A P51151 4/20 0.51
▸ MAPT P10636 1/20 0.51
▸ HPGD P15428 1/20 0.51
▸ HDAC1 Q13547 1/20 0.51
▸ MMP13 P45452 1/20 0.50
▸ ESRRA P11474 1/20 0.50
▸ P2RY14 Q15391 3/20 0.49
▸ LMNA P02545 2/20 0.48
▸ MEN1 O00255 2/20 0.48
▸ KMT2A Q03164 2/20 0.48
▸ NPC1 O15118 5/20 0.48
▸ SMN1; SMN2 Q16637 2/20 0.48
▸ GAA P10253 2/20 0.48
▸ TP53 P04637 1/20 0.48
▸ AHR P35869 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2605541 0.94 KCNMA1 (0.71) KCNMA1RAB9AMAPTHDAC1MMP13
SCHEMBL19846843 0.86 KCNMA1 (0.62) KCNMA1RAB9AMAPTHPGDHDAC1
SCHEMBL6029542 0.85 KCNMA1 (0.84) KCNMA1RAB9AMAPTHDAC1MEN1
SCHEMBL1108313 0.84 HPGD (0.49) KCNMA1RAB9AMAPTHPGDHDAC1
SCHEMBL2605548 0.84 KCNMA1 (0.82) KCNMA1RAB9AMAPTHDAC1MEN1
SCHEMBL14363236 0.81 KCNMA1 (0.77) KCNMA1RAB9AMAPTHDAC1MEN1
SCHEMBL14363221 0.80 KCNMA1 (0.67) KCNMA1RAB9AMAPTHDAC1LMNA
SCHEMBL21360970 0.80 KCNMA1 (0.69) KCNMA1RAB9AMAPTHPGDMEN1
SCHEMBL5427738 0.79 KDR (0.53) KCNMA1HDAC1MMP13MEN1KMT2A
SCHEMBL13955813 0.78 ESRRA (0.48) KCNMA1RAB9AMAPTHPGDHDAC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8501375-B2 Positive photosensitive resin composition CHEIL INDUSTRIES INC. (KR) 2013-08-06 — — US disclosed
US-20120156616-A1 Positive Photosensitive Resin Composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-06-21 — — US disclosed
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