SCHEMBL2605553

SCHEMBL2605553

CC(C)(C1CCC(c2ccc(O)cc2)(c2ccc(O)cc2)CC1)C1CCCC(C(C)(C)C2CCC(c3ccc(O)cc3)(c3ccc(O)cc3)CC2)C1

nearest known ligand 0.49

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 14/20 0.49
ESR1 P03372 10/20 0.49
OPRM1 P35372 1/20 0.33
OPRD1 P41143 1/20 0.33
OPRK1 P41145 1/20 0.33
CYP3A4 P08684 1/20 0.33
CYP2D6 P10635 1/20 0.33
CYP2C9 P11712 1/20 0.33
GAA P10253 1/20 0.31
KMT2A Q03164 1/20 0.31
HSD11B1 P28845 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9065276 0.91 ESR2 (0.55) ESR2ESR1OPRM1OPRD1OPRK1
SCHEMBL45831 0.91 ESR2 (0.53) ESR2ESR1OPRM1OPRD1OPRK1
SCHEMBL2605552 0.89 ESR2 (0.52) ESR2ESR1OPRM1OPRD1OPRK1
SCHEMBL25767034 0.84 ESR2 (0.47) ESR2ESR1OPRM1KMT2A
SCHEMBL20684752 0.84 ESR2 (0.47) ESR2ESR1OPRM1OPRD1OPRK1
SCHEMBL25767236 0.83 ESR2 (0.46) ESR2ESR1OPRM1OPRD1OPRK1
SCHEMBL12606668 0.82 ESR1 (0.57) ESR2ESR1OPRM1OPRD1OPRK1
SCHEMBL2605557 0.81 ESR2 (0.55) ESR2ESR1OPRM1OPRD1OPRK1
SCHEMBL23250802 0.81 ESR2 (0.46) ESR2ESR1OPRM1OPRD1OPRK1
SCHEMBL2498416 0.80 ESR2 (0.53) ESR2ESR1OPRM1CYP3A4GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2306244-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM AND USE OF THE CURED FILM SUMITOMO BAKELITE CO (JP) 2013-11-06 EP disclosed
US-8440734-B2 Positive photosensitive resin composition, cured film, protecting film, insulating film, and semiconductor device and display device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2013-05-14 US disclosed
US-8440734-B2 Positive photosensitive resin composition, cured film, protecting film, insulating film, and semiconductor device and display device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2013-05-14 US disclosed
US-8158324-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2012-04-17 US disclosed
US-20110118375-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTING FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-05-19 US disclosed
US-20110118375-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTING FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-05-19 US disclosed
EP-2306244-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATION FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING SAME Sumitomo Bakelite Company Limited (JP) 2011-04-06 EP disclosed
US-20100099041-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2010-04-22 US disclosed