Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOA | P21397 | 5/20 | 0.43 |
| ▸ | MAOB | P27338 | 5/20 | 0.43 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | ATM | Q13315 | 1/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
| ▸ | PDK2 | Q15119 | 1/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.34 |
| ▸ | ESR1 | P03372 | 1/20 | 0.34 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.34 |
| ▸ | GSTP1 | P09211 | 1/20 | 0.33 |
| ▸ | ACHE | P22303 | 1/20 | 0.33 |
| ▸ | NPC1 | O15118 | 1/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | RAB9A | P51151 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9849209 | 0.94 | MAOA (0.40) | MAOAMAOBTDP1L3MBTL1MAPT | |
| SCHEMBL18180026 | 0.91 | MAOA (0.37) | MAOAMAOBTDP1L3MBTL1MAPT | |
| SCHEMBL15699449 | 0.90 | SRD5A2 (0.41) | MAOAMAOBLMNANPC1POLB | |
| SCHEMBL12583807 | 0.88 | MAOA (0.45) | MAOAMAOBTDP1L3MBTL1MAPT | |
| SCHEMBL10416153 | 0.88 | MAOB (0.45) | MAOAMAOBTDP1L3MBTL1MAPT | |
| SCHEMBL15699450 | 0.87 | AKR1C3 (0.51) | MAOAMAOBALDH1A1NPC1POLB | |
| SCHEMBL11887460 | 0.85 | MAOA (0.41) | MAOAMAOBTDP1L3MBTL1MAPT | |
| SCHEMBL1501398 | 0.83 | MAOA (0.56) | MAOAMAOBTDP1L3MBTL1MAPT | |
| SCHEMBL30970619 | 0.83 | MAOA (0.56) | MAOAMAOBTDP1L3MBTL1MAPT | |
| SCHEMBL84254 | 0.83 | MAOA (0.56) | MAOAMAOBTDP1L3MBTL1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9139696-B1 | Aromatic diamines containing three ether-linked-benzonitrile moieties, polymers thereof, and methods of making the same | THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) | 2015-09-22 | — | — | US | claimed |
| US-11782344-B2 | Photosensitive polyimide compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2023-10-10 | — | — | US | disclosed |
| US-20230260787-A1 | COMPOSITION FOR FORMING PROTECTIVE FILM AGAINST ALKALINE AQUEOUS HYDROGEN PEROXIDE, SUBSTRATE FOR PRODUCING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING PROTECTIVE FILM, AND METHOD FOR FORMING PATTERN | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4215988-A1 | COMPOSITION FOR FORMING PROTECTIVE FILM AGAINST ALKALINE AQUEOUS HYDROGEN PEROXIDE, SUBSTRATE FOR PRODUCING SEMICONDUCTOR APPARATUS, METHOD FOR FORMING PROTECTIVE FILM, AND METHOD FOR FORMING PATTERN | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-07-26 | — | — | EP | disclosed |
| US-20230229080-A1 | PHOTOSENSITIVE COMPOSITION AND FILM PREPARED FROM THE SAME | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 2023-07-20 | — | — | US | disclosed |
| US-11692066-B2 | Material for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and compound for forming organic film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-07-04 | — | — | US | disclosed |
| US-20230205085-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | DONGJIN SEMICHEM CO., LTD. (KR) | 2023-06-29 | — | — | US | disclosed |
| WO-2023106104-A1 | PHOTOSENSITIVE RESIN COMPOSITION | 日産化学株式会社 | 2023-06-15 | — | — | WO | disclosed |
| CN-115947939-A | Polymer, and production method and application thereof | 上海邃铸科技有限公司 | 2023-04-11 | — | — | CN | disclosed |
| EP-3286606-B1 | PHOTOSENSITIVE POLYIMIDE COMPOSITIONS | FUJIFILM ELECTRONIC MAT USA INC (US) | 2022-12-28 | — | — | EP | disclosed |
| US-7364797-B2 | Adhesive composition and adhesive film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-04-29 | — | — | US | disclosed |
| US-7364797-B2 | Adhesive composition and adhesive film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-04-29 | — | — | US | disclosed |
| US-20070191552-A1 | excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance for semiconductor packages; polyimidesiloxane copolymer, epoxy resin, finely powdered silica, curing catalyst | SHIN-ETSU CHEMICAL CO., LTD. | 2007-08-16 | — | — | US | disclosed |
| US-20070191552-A1 | excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance for semiconductor packages; polyimidesiloxane copolymer, epoxy resin, finely powdered silica, curing catalyst | SHIN-ETSU CHEMICAL CO., LTD. | 2007-08-16 | — | — | US | disclosed |
| US-20070120271-A1 | Dicing and die bonding adhesive tape | SHIN-ETSU CHEMICAL CO., LTD. | 2007-05-31 | — | — | US | disclosed |
| US-20070120271-A1 | Dicing and die bonding adhesive tape | SHIN-ETSU CHEMICAL CO., LTD. | 2007-05-31 | — | — | US | disclosed |
| US-20070090299-A1 | Adhesive composition and sheet having an adhesive layer of the composition | SHIN-ETSU CHEMICAL CO., LTD. | 2007-04-26 | — | — | US | disclosed |
| US-20070090299-A1 | Adhesive composition and sheet having an adhesive layer of the composition | SHIN-ETSU CHEMICAL CO., LTD. | 2007-04-26 | — | — | US | disclosed |
| US-20070066796-A1 | Resin solution composition, polyimide resin, and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. | 2007-03-22 | — | — | US | disclosed |
| US-20070066796-A1 | Resin solution composition, polyimide resin, and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. | 2007-03-22 | — | — | US | disclosed |